LC1500 high thermal conductivity silicon pad is a high-performance heat conduction interface material, It is used to fill the air gap between the heating device and the heat sink or metal base. Their flexible and elastic characteristics enable it to cover completely uneven surfaces. The heat is transferred from the separated device or the whole PCB to the metal shell or the diffusion plate, which can effectivelyimprove the heat dissipation performance and the eficiency and servicelfe ofthe heating electronic components.