LC150 thermal conductive pad is a very cost-effective general economic thermal interfaca material, soft with its own micro-stick, easy assembly. Under low compressing force to show good thermal conductivity and electrical insulation properties. Bedding on the gap between the heat device and the heat sink or the machine shell to extrude air to reach the full contact forming a continuous thermal conduction. Using heat sink or machine shell as a cooling device can effectively increase the cooling area to achieve a good cooling purposes.
Test item |
Unit | LC150 | Test Method |
Colour | - | Off-White |
Visually |
Thickness |
mm |
0.3~15 |
ASTM D374/374M |
Hardness |
Shore AO |
30±5 |
GB/T531 |
Hardness |
Shore OO |
60±10 |
ASTM D2240 |
Specific gravity |
g/cm³ |
2.26±0.2 |
ASTM D792 |
Tensile Strength |
Mpa |
0.29 |
ASTM D412 |
Elongation at break |
% |
100 |
ASTM D412 |
Breakdown Voltage |
KV/mm |
≥10 |
ASTM D149 |
Volume resistivity |
Ω·cm |
1x10¹³ |
ASTM D257 |
Temperature resistance range |
℃ |
-40~150 |
- |
Flame |
- | V-0 | UL 94 |
Weight loss |
% |
≤0.4 |
@150℃240H |
Permittivity |
@1MHz |
5.3 |
ASTM D150 |
Thermal conductivity |
W/m·k |
1.5±0.15 |
ISO 22007-2 |
Thermal conductivity |
W/m·k |
1.5±0.15 |
ASTM D5470 |
Thermal impedance |
℃·in² /W |
1.135 |
ASTM D5470 |
Thermal impedance |
℃·in² /W |
7.324 |
ASTM D5470 |
Specific Heat Capacity |
J/g/k |
1.039 |
ASTM E1269 |
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