The existence of the thermal conductive silicone pad is mainly not directly radiated, and the heat dissipation is required by the heat sink. When the heat source is connected to the heat sink, the contact surface roughness is irregular, so a certain contact thermal resistance and contact thermal resistance are generated. It is caused by heat transfer. The contact thermal resistance will make the heat conduction channel not smooth, so that the heat accumulation on the contact surface is too large, so that it cannot be quickly and effectively conducted to the surface of the heat sink or the outer casing, so if it is not filled with a thermal conductive pad, It is difficult to achieve effective cooling. Without the use of thermal silica gel sheets, even the product will transiently overheat during thermal shock, resulting in a crash to reduce product life. At the same time, air is a poor conductor of heat, if the space between the contact surfaces is too large or there is The effect of the gap on the heat dissipation is huge. The thermal conductive silica gel pad is solid and soft, has good compression performance, and is not easily deformed. It can fill the contact area well and make all the bad conductors of the contact surface are discharged. Therefore, it is required in various industries in the electronics industry. Thermally conductive silicone sheets are basically used in places where heat is dissipated.

Any company's thermal silica gel sheet will have silicone oil in it. In addition to silicone-free silicone pad, our production process has been specially treated with high-temperature chemical treatment and vacuum treatment to solve the problem of silicone oil precipitation. After the test, it was concluded that our thermal silica film did not have silicone oil.

Thermal grease is also called thermal grease. Its main raw material is silicone germanium. It is made by adding high-performance thermal conductive materials such as thermal powder. It is used for heat dissipation of high-frequency electronic components such as power amplifiers, heat-generating transistors, and CPUs. The parts operate in an excellent temperature environment.

Answer：Usually, when we choose a thermal silica film, the primary concern is the conductivity coefficient of the product. The thermal conductivity directly affects the heat transfer efficiency. The thermal silica film itself does not have a heat dissipation effect. Only the conduction effect, the heat source is through the heat conduction. Silicone sheets are used to transfer heat to the heat sink or housing to reduce the temperature of the heat source. Therefore, the choice of thickness and hardness of the heat conductive silicone sheet is also critical in thermal design.

Generally, the power battery and the battery module are relatively large in area relative to the consumer electronic products. If the thermal conductivity silicone sheet is too soft, it is not convenient for construction operation. If it is too soft, it is easy to deform the thermal silica gel sheet during construction, and the assembly area is not easy to master. Therefore, it is recommended that the hardness of the battery pack or the battery module is generally about 50.