Thermal Pad
  • LC200 Thermal Conductive Silicone Pad
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  • LC200 Thermal Conductive Silicone Pad
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LC200 Thermal Conductive Silicone Pad

Specification:
Standard size: 200mm×400mm, 300mm×400mm; Customized size available;
Introduction:
LC200 thermal pad is a very cost-effective general economic thermal gap filling gasket, soft with its own micro-stick, easy assembly. Under low compressing force to show good thermal conductivity and electrical insulation properties. Bedding on the gap between the heat device and the heat sink or the machine shell to extrude air to reach the full contact forming a continuous thermal conduction. Using heat sink or machine shell as a cooling device can effectively increase the cooling area to achieve a good cooling purposes.
  • Product introduction
  • Technical Parameters
  • Product Application
  • Product Characteristics
LC200 thermal conductive pad is a very cost-effective general economic thermal interfaca material, soft with its own micro-stick, easy assembly. Under low compressing force to show good thermal conductivity and electrical insulation properties. Bedding on the gap between the heat device and the heat sink or the machine shell to extrude air to reach the full contact forming a continuous thermal conduction. Using heat sink or machine shell as a cooling device can effectively increase the cooling area to achieve a good cooling purposes.
Test item
Unit LC200 Test Method
Colour - Blue Visually
Thickness
mm 0.3~15
ASTM D374/374M
Hardness
Shore AO
30±5
GB/T531
Hardness
Shore OO
60±10
ASTM D2240
Specific gravity
g/cm³
2.79±0.2
ASTM D792
Tensile Strength
Mpa
0.23
ASTM D412
Elongation at break
%
110
ASTM D412
Breakdown Voltage
KV/mm
≥10
ASTM D149
Volume resistivity
Ω·cm
 1x10¹³
ASTM D257
Temperature resistance range

-40~200
-
Flame
- V-0 UL 94
Weight loss
%
≤0.3
@150℃240H
Permittivity
@1MHz
6.6
ASTM D150
Thermal conductivity
W/m·k
2.0±0.2
ISO 22007-2
Thermal conductivity
W/m·k
2.0±0.2
ASTM D5470
Thermal impedance
 ℃·in² /W
0.921
ASTM D5470
Thermal impedance
 ℃·in² /W
5.939
ASTM D5470
Specific Heat Capacity
 J/g/k
0.938
ASTM E1269


  • Computer / communication equipment.
  • Laptop / tablet / PC server.
  • New energy power battery / vehicle equipment.
  • Switching power supply / UPS.
  • Video / security equipment.
  • Any heating element and radiator.


  • Low cost, high efficiency and high cost performance.
  • Thermal conductive silicone grease to replace volatile pollution.
  • Natural stickiness, easy assembly, repeatable disassembly.
  • High electrical insulation.

Contact

Tel:+86-13691979380

E-mail:ElvinLen@szutd.com

Address:Union Tenda Technology Park, No. 61, Zhangqi Road, Guixiang Community,Guanlan Street, Longhua District, Shenzhen