LC1300BN Ultra-High Thermal Conductivity Silicone Pad – 13 W/m·K

The LC1300BN Ultra-High Thermal Conductivity Silicone Pad is a high-performance thermal interface material (TIM) designed to provide efficient heat transfer in high-power electronic devices. With a thermal conductivity of 13.0 ± 0.5 W/m·K, it helps reduce interface thermal resistance and improve the overall reliability and operating life of electronic components.

This advanced thermal conductive pad combines high-purity boron nitride (BN) fillers with a silicone elastomer matrix. Its optimized thermal conduction network delivers excellent heat dissipation while maintaining the flexibility and ease of installation expected from a high-quality silicone thermal pad.

Available in thicknesses from 0.3 mm to 5 mm, the LC1300BN conforms closely to uneven surfaces and fills microscopic air gaps between heat-generating components and heat sinks. It is an ideal solution for 5G communication equipment, new energy vehicles, high-performance computing systems, industrial controls, power electronics and other demanding thermal-management applications.

Typical Applications

CPU and GPU Thermal Management

The LC1300BN thermal pad provides an efficient heat-transfer path between CPUs, GPUs, memory modules and heat sinks. It is suitable for high-performance computers, servers, AI computing hardware and other systems containing high-heat-generating components.

5G and Telecommunications Equipment

This heat conductive silicone pad can be used in base stations, antennas, 5G modules, radio units and other telecommunications equipment. Its high thermal conductivity helps control component temperatures and supports stable operation under demanding conditions.

New Energy Vehicles

The LC1300BN is suitable for thermal management in EV battery systems, electronic control units (ECUs), motor control modules, onboard electronics and automotive LED lighting systems. Its electrical insulation and wide operating temperature range make it well suited to automotive environments.

Industrial and Power Electronics

The material can be installed in industrial control systems, inverters, power supplies, power modules, automation equipment and other high-power devices that require efficient heat dissipation and reliable electrical insulation.

Why Choose the LC1300BN Thermal Pad?

The LC1300BN combines high thermal conductivity, electrical insulation and mechanical flexibility in a single TIM thermal pad. By filling surface gaps and improving contact between electronic components and cooling hardware, it creates a reliable thermal path that helps reduce operating temperatures and enhance system stability.

For applications requiring a flexible thermal silicone pad with outstanding heat-transfer performance, the LC1300BN offers an effective thermal-management solution across telecommunications, automotive, computing and industrial markets.