The LC1500 Thermal Conductive Silicone Pad is a high-performance thermal interface material developed for high-power-density components and applications with demanding heat dissipation requirements. With a thermal conductivity of 15.0 ± 0.5 W/m·K, this high-conductivity thermal pad efficiently transfers heat from electronic components to heat sinks, metal housings, or cooling modules.
Its soft and compressible structure conforms closely to uneven component surfaces, fills air gaps, and reduces interface thermal resistance. This creates a stable thermal pathway that improves cooling efficiency, helps prevent overheating, and supports the reliable long-term operation of high-performance electronic equipment.
Available in thicknesses from 0.8 mm to 10 mm, the LC1500 silicone thermal pad can accommodate different gap sizes and assembly requirements. Its combination of high thermal conductivity, flexibility, compressibility, and gap-filling performance makes it a reliable thermal management solution for electronics, telecommunications, automotive systems, and industrial equipment.
The LC1500 thermal interface pad is suitable for transferring heat between CPUs, GPUs, processors, and other high-heat-generating components and their heat sinks. It can also provide stable, long-term thermal management for telecommunications equipment such as 5G base stations, routers, servers, and network devices.
In automotive electronics, this thermal silicone pad can be applied to battery packs, battery management systems, electronic control units (ECUs), motor control modules, onboard electronics, and automotive LED lighting. It is also suitable for high-power industrial automation equipment, including control devices, frequency inverters, power supplies, IGBT modules, and other power electronic components.
Product name: LC1500 Thermal Conductive Silicone Pad
Thermal conductivity: 15.0 ± 0.5 W/m·K
Available thickness: 0.8–10 mm
Material type: Soft, compressible thermal silicone pad
Primary function: Gap filling, heat transfer, and interface thermal resistance reduction
Typical applications: CPUs, GPUs, heat sinks, communication equipment, automotive electronics, battery systems, LED lights, industrial controls, inverters, and power modules
Tel:+86-13691979380
+86-18126358702
E-mail:elvinlen@szutd.com
kacey@szutd.com
Address:8th Floor, Tower B, Lechuanghui Building, No. 1211 Guanguang Road, Longhua District, Shenzhen City, Guangdong Province
Send Request
Whatsapp
