The LC1200 Thermal Conductive Silicone Pad is a high-performance thermal interface material specifically designed for high-power-density devices and applications with demanding heat dissipation requirements. Featuring a high thermal conductivity of 12.0 ± 0.5 W/m·K, this silicone thermal pad creates close contact between heat-generating components and heat sinks, effectively filling surface gaps, reducing interface thermal resistance, and improving overall cooling efficiency.
Available in thicknesses ranging from 0.8 mm to 10 mm, the LC1200 high-conductivity thermal pad offers excellent softness and compressibility, allowing it to conform easily to irregular component surfaces under pressure. With a dielectric strength of ≥6 kV/mm, it provides reliable electrical insulation while maintaining efficient heat transfer. Its density of 3.50 ± 0.2 g/cm³ and wide operating temperature range of -40°C to 150°C make it suitable for stable, long-term use in challenging thermal environments.
Combining outstanding thermal conductivity, electrical insulation, flexibility, and gap-filling performance, the LC1200 thermal silicone pad is widely used in electronic devices, power modules, communication equipment, automotive electronics, battery systems, LED lighting, industrial control systems, and other advanced thermal management applications.
|
Test Items |
Unit |
LC1200 |
Test Standard |
|
Appearance |
- |
Gray |
Visual |
|
Thickness |
mm |
0.8~10.0 |
ASTM D374/374M |
|
Hardness |
Shore AO |
20±5 |
ISO 48-4 |
|
Hardness |
Shore OO |
70±10 |
ASTM D2240 |
|
Density |
g/cm3 |
3.50±0.2 |
ASTM D792 |
|
Tensile Strength |
MPa |
≥0.06 |
ASTM D412 |
|
Elongation at Break |
% |
≥40 |
ASTM D412 |
|
Dielectric Strength |
KV/mm |
≥6 |
ASTM D149 |
|
Volume Resistivity |
Ω·cm |
≥1×1013 |
ASTM D257 |
|
Weight Loss |
% |
≤0.2 |
150℃240H |
|
Dielectric Constant |
1MHz |
8.5-9.5 |
ASTM D150 |
|
Thermal Conductivity |
W/m·K |
12.0±0.5 |
ISO 22007-2 |
|
Thermal Conductivity |
W/m·K |
12.0±0.5 |
ASTM D5470 (Three thickness fitting) |
|
Thermal Impedance |
℃·in²/W |
0.135 |
ASTM D5470（1mm 10psi） |
|
Thermal Impedance |
℃·cm²/W |
0.871 |
ASTM D5470（1mm 10psi） |
|
Flammability |
Class |
V-0 |
UL94 |
|
Operating Temperature |
℃ |
-40~150 |
- |
|
Test Items |
Unit |
LC1200 |
Test Standard |
|
Appearance |
- |
Gray |
Visual |
|
Thickness |
mm |
0.8~10.0 |
ASTM D374/374M |
|
Hardness |
Shore AO |
20±5 |
ISO 48-4 |
|
Hardness |
Shore OO |
70±10 |
ASTM D2240 |
|
Density |
g/cm3 |
3.50±0.2 |
ASTM D792 |
|
Tensile Strength |
MPa |
≥0.06 |
ASTM D412 |
|
Elongation at Break |
% |
≥40 |
ASTM D412 |
|
Dielectric Strength |
KV/mm |
≥6 |
ASTM D149 |
|
Volume Resistivity |
Ω·cm |
≥1×1013 |
ASTM D257 |
|
Weight Loss |
% |
≤0.2 |
150℃240H |
|
Dielectric Constant |
1MHz |
8.5-9.5 |
ASTM D150 |
|
Thermal Conductivity |
W/m·K |
12.0±0.5 |
ISO 22007-2 |
|
Thermal Conductivity |
W/m·K |
12.0±0.5 |
ASTM D5470 (Three thickness fitting) |
|
Thermal Impedance |
℃·in²/W |
0.135 |
ASTM D5470（1mm 10psi） |
|
Thermal Impedance |
℃·cm²/W |
0.871 |
ASTM D5470（1mm 10psi） |
|
Flammability |
Class |
V-0 |
UL94 |
|
Operating Temperature |
℃ |
-40~150 |
- |
Typical Applications
-Used for thermal conduction between CPUs, GPUs, and other high-heat-generating components and heat sinks.
-Suitable for devices like base stations and routers that require long-term stable cooling.Features and Advantages
-Ultra-high thermal conductivity significantly reduces the risk of overheating.
-Easy to assemble and allows for repeated disassembly and reassembly.
-Effectively fills micro-gaps on contact surfaces, reducing thermal resistance.
-Exceptional weather and aging resistance make it ideal for long-term use.
Tel:+86-13691979380
+86-18126358702
E-mail:elvinlen@szutd.com
kacey@szutd.com
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