2 W/m-K 0.5mm Thickness Thermal Conductive Silicone Pads Self-adhesive GPU CPU Heat Dissipation Insulation Sheet Pad

The LC200 Thermal Silicone Pad is a general-purpose, cost-effective thermal interface material designed for efficient heat dissipation and reliable electrical insulation. Its soft texture and natural slight tackiness make it easy to cut, position, and assemble without additional adhesive.

Placed between heat-generating components and heat sinks, metal housings, or machine casings, the LC200 thermal pad effectively fills uneven gaps and displaces trapped air under low compression force. This creates a continuous thermal pathway with reduced contact thermal resistance, allowing heat to transfer efficiently to a larger dissipation surface and significantly improving cooling performance and equipment reliability.

With a thermal conductivity of 2.0 ± 0.2 W/m·K and a thickness of 0.5 mm, the LC200 silicone thermal pad delivers a practical balance of thermal performance, electrical insulation, mechanical stability, and cost efficiency. It is suitable for LED lighting, power supplies, communication equipment, automotive electronics, industrial control systems, consumer electronics, and other electronic heat-management applications.

Key Specifications

• Product: LC200 Thermal Silicone Pad

• Thermal Conductivity: 2.0 ± 0.2 W/m·K

• Thickness: 0.5 mm

• Tensile Strength: ≥0.30 MPa

• Operating Temperature: -40°C to 150°C

• Key Features: Soft, slightly tacky, electrically insulating, easy to assemble, and effective under low compression

• Compliance: UL, RoHS, and REACH