Thermal Pad
  • 8 W/m-K High Thermal Conductivity Silicone Gap Pad 0.5mm Thermal Interface Mater
  • IMG_9991 拷贝.jpg
  • LC800.png
  • 8 W/m-K High Thermal Conductivity Silicone Gap Pad 0.5mm Thermal Interface Mater
  • IMG_9991 拷贝.jpg
  • LC800.png

8 W/m-K High Thermal Conductivity Silicone Gap Pad 0.5mm Thermal Interface Mater

Specification:
Introduction:
  • Product introduction
  • Technical Parameters
  • Product Application
  • Product Characteristics

8 W/m-K High Thermal Conductivity Silicone Gap Pad 0.5mm Thermal Interface Material High Performance Thermal Pad

Thermal Silicone Pad | LC800

The LC800 thermal silicone pad is a thermal material specifically designed for high-power density devices and applications with high heat dissipation demands. It effectively enhances the heat dissipation efficiency of devices by closely connecting the heat source to the heatsink, thereby reducing interface thermal resistance. With its excellent thermal conductivity, softness, and compressibility, it is widely used in various electronic devices, communication equipment, and automotive electronics.

Test Items

Unit

LC800

Test Standard

Appearance

-

Gray

Visual

Thickness

mm

0.5~10.0

ASTM D374/374M

Hardness

Shore AO

30±5

ISO 48-4

Hardness

Shore OO

70±10

ASTM D2240

Density

g/cm3

3.55±0.2

ASTM D792

Tensile Strength

MPa

≥0.15

ASTM D412

Elongation at Break

%

≥20

ASTM D412

Dielectric Strength

KV/mm

≥7

ASTM D149

Volume Resistivity

Ω·cm

1×1012

ASTM D257

Weight Loss

%

0.2

150℃240H

Dielectric Constant

1MHz

8.8-10.0

ASTM D150

Thermal Conductivity

W/m·K

8.0±0.5

ISO 22007-2

Thermal Conductivity

W/m·K

8.0±0.5

ASTM D5470 (Three thickness fitting)

Thermal Impedance

℃·in²/W

0.207

ASTM D54701mm 10psi

Thermal Impedance

℃·cm²/W

1.337

ASTM D54701mm 10psi

Flammability

Class

V-0

UL94

Operating Temperature

-40~150

-

Specific Heat Capacity

J/g/K

0.722

ASTM E1269

Typical Applications

-Used for thermal conduction between high-performance computer CPUs, GPUs, and other heat-generating components and heatsinks
-Used for heat dissipation in communication equipment such as base stations, antennas, and 5G modules
-Applied in automotive battery systems, electronic control units (ECU), 

Features and Advantages

-Ultra-high thermal conductivity, significantly reducing the risk of overheating
-Easy to assemble and disassemble
-Effectively fills micro-gaps in contact surfaces, reducing thermal resistance
-Exceptional weather and aging resistance, suitable for long-term use

Contact

Tel:+86-13823207234

E-mail:luffy@szutd.com

Address:8th Floor, Tower B, Lechuanghui Building, No. 1211 Guanguang Road, Longhua District, Shenzhen City, Guangdong Province