6 W/m K 0.5-10 mm Thickness Low Thermal Resistance Thermal Conductive Silicone P-Thermal Pad-Shenzhen Union Tenda Technology Co.,Ltd

6 W/m K 0.5-10 mm Thickness Low Thermal Resistance Thermal Conductive Silicone P

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6 W/m K 0.5-10 mm Thickness Low Thermal Resistance Thermal Conductive Silicone Pad Thermal Transfer Pad Sheet

Thermal Silicone Pad | LC600

The LC600 thermal conductive silicone pad is a high thermal conductivity gap filler pad with excellent thermal performance. It is soft, slightly adhesive, and easy to assemble. Under low compression force, it demonstrates good thermal conductivity and electrical insulation properties. It is placed between heat-generating components and heat sinks or device enclosures, expelling air to ensure full contact and form a continuous thermal conduction path. By using the heat sink or device enclosure as a cooling component, the heat dissipation area is effectively increased, significantly enhancing cooling efficiency.

Test Items	Unit	LC600	Test Standard
Appearance	-	Gray	Visual
Thickness	mm	0.5~10	ASTM D374/374M
Hardness	Shore AO	30±5	ISO 48-4
Hardness	Shore OO	60±10	ASTM D2240
Density	g/cm³	3.30±0.2	ASTM D792
Tensile Strength	MPa	≥0.10	ASTM D412
Elongation at Break	%	≥40	ASTM D412
Dielectric Strength	KV/mm	≥10	ASTM D149
Volume Resistivity	Ω·cm	≥1×10¹³	ASTM D257
Weight Loss	%	≤0.3	150℃240H
Dielectric Constant	1MHz	7.5-8.4	ASTM D150
Thermal Conductivity	W/m·K	6.0±0.3	ISO 22007-2
Thermal Conductivity	W/m·K	6.0±0.3	ASTM D5470 (Three thickness fitting)
Thermal Impedance	℃·in²/W	0.225	ASTM D5470（1mm 10psi）
Thermal Impedance	℃·cm²/W	1.454	ASTM D5470（1mm 10psi）
Flammability	Class	V-0	UL94
Operating Temperature	℃	-40~200	-
Specific Heat Capacity	J/（g/K）	0.906	ASTM E1269

Typical Applications
-Used for thermal conduction between CPUs, GPUs, and other high-heat-generating components and heat sinks.
-Suitable for devices requiring long-term stable heat dissipation, such as base stations and routers.
-Applied to areas needing heat dissipation in automotive batteries, electronic control units (ECU), motor control modules, and LED lights.
-Used for thermal management in AC/DC power supplies, inverters, and UPS (uninterruptible power supply) systems.

Features and Advantages
-High thermal conductivity reduces the risk of overheating.
-Naturally adhesive, easy to assemble, and allows for repeated disassembly and reassembly.
-Excellent softness and compressibility, capable of filling various uneven gaps of different sizes.
-Exceptional weather and aging resistance, making it suitable for long-term use.

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6 W/m K 0.5-10 mm Thickness Low Thermal Resistance Thermal Conductive Silicone P

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