• 4 W/m K TIM Thermal Pad Heat Conductive Silicone Heat Sink Pad GPU CPU Thermal Pad
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• Thermal Silicone Pad |LC400
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• The LC400 thermal conductive silicone pad is a high-thermal-conductivity gap filler pad with excellent thermal performance. It is soft with a slight inherent tackiness, making it easy to assemble. It performs well under low compressive force, offering both effective thermal conductivity and electrical insulation. Positioned between heat-generating components and heat sinks or device enclosures, it displaces air to ensure full contact, forming a continuous thermal conduction pathway. By using the heat sink or device enclosure as the thermal dissipation surface, the heat dissipation area is effectively increased, thereby significantly enhancing cooling efficiency.
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• High performance silicone thermal pad, flexible thermal gap filler with low thermal resistance.
• Soft & compressible to fill gaps between heat sink and electronic components.
• Good electrical insulation, high temperature resistance, RoHS & UL certified.
• Custom die-cut size & thermal conductivity available.
• Widely used for power supply, LED, PCB, new energy and industrial electronics cooling, factory sample & OEM service supported.
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Features and Advantages
-High thermal conductivity reduces the risk of overheating.
-Natural tackiness makes it easy to assemble and allows for repeated disassembly and reassembly.
-Excellent softness and compressibility enable it to fill gaps of various sizes and uneven surfaces.
-Exceptional weather and aging resistance make it suitable for long-term use.

Typical Applications
-Used for thermal conduction between CPUs, GPUs, and other high-heat-generating components and heat sinks.
-Suitable for devices like base stations and routers that require long-term stable cooling.
-Applied to heat-dissipating areas in automotive batteries, electronic control units (ECUs), motor control modules, LED lights, and more.
-Used for thermal management in AC/DC power supplies, inverters, and UPS systems.