LC300 3 W/m K Custom Die-Cut Low Thermal Resistance Thermal Conductive Silicone -Thermal Pad-Shenzhen Union Tenda Technology Co.,Ltd

LC300 3 W/m K Custom Die-Cut Low Thermal Resistance Thermal Conductive Silicone

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Introduction:

Thermal Silicone Pad | LC300 The LC300 thermal silicone pad is a general-purpose, cost-effective thermal interface material with high cost performance. It is soft with natural slight stickiness, making it easy to assemble. Under low compression force, it exhibits good thermal conductivity and electrical insulation properties. It is placed in the gap between heat-generating components and heat sinks or machine casings, extruding air to achieve full contact and form a continuous thermal path. By using heat sinks or machine casings as heat dissipation devices, the effective heat dissipation area can be increased, thereby significantly improving cooling performance.

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3 W/m K Thermal Conductive Silicone Pad Custom Die-Cut Low Thermal Resistance Thermal Gap Filler Pad

Thermal Silicone Pad | LC300

The LC300 thermal silicone pad is a general-purpose, cost-effective thermal interface material with high cost performance. It is soft with natural slight stickiness, making it easy to assemble. Under low compression force, it exhibits good thermal conductivity and electrical insulation properties. It is placed in the gap between heat-generating components and heat sinks or machine casings, extruding air to achieve full contact and form a continuous thermal path. By using heat sinks or machine casings as heat dissipation devices, the effective heat dissipation area can be increased, thereby significantly improving cooling performance.

Test Items	Unit	LC300	Test Standard
Appearance	-	Gray-White	Visual
Thickness	mm	0.5~15	ASTM D374/374M
Hardness	Shore AO	30±5	ISO 48-4
Hardness	Shore OO	60±10	ASTM D2240
Density	g/cm³	3.07±0.2	ASTM D792
Tensile Strength	MPa	≥0.16	ASTM D412
Elongation at Break	%	≥100	ASTM D412
Dielectric Strength	KV/mm	≥10	ASTM D149
Volume Resistivity	Ω·cm	≥1×10¹³	ASTM D257
Weight Loss	%	≤0.3	150℃240H
Dielectric Constant	1MHz	6.8~7.6	ASTM D150
Thermal Conductivity	W/m·K	3.0±0.3	ISO 22007-2
Thermal Conductivity	W/m·K	3.0±0.3	ASTM D5470 (Three thickness fitting)
Thermal Impedance	℃·in²/W	0.586	ASTM D5470（1mm 10psi）
Thermal Impedance	℃·cm²/W	3.779	ASTM D5470（1mm 10psi）
Flammability	Class	V-0	UL94
Operating Temperature	℃	-40~200	-
Specific Heat Capacity	J/（g/K）	0.952	ASTM E1269

Typical Applications

Thermal interface between chips, processors, storage devices, and heat sinks or casings
Devices such as base stations and routers that require long-term stable cooling
Thermal interface in automotive electronic control units (ECU) and battery management systems (BMS)
Thermal management between power modules and heat sinks

Features and Advantages

Low cost, high efficiency, and high cost performance
Natural stickiness, easy to assemble, and can be disassembled and reassembled multiple times
Excellent softness and compressibility, capable of filling various uneven gaps of different sizes
Extremely good weather resistance and aging resistance, suitable for long-term use

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Address:8th Floor, Tower B, Lechuanghui Building, No. 1211 Guanguang Road, Longhua District, Shenzhen City, Guangdong Province

LC300 3 W/m K Custom Die-Cut Low Thermal Resistance Thermal Conductive Silicone

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