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  • LC1000 Thermal Conductive Silicone Pad
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  • LC1000 Thermal Conductive Silicone Pad
  • IMG_9984.jpg
  • IMG_9985.jpg
  • IMG_9986.jpg
  • IMG_9987.jpg
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LC1000 Thermal Conductive Silicone Pad

Specification:
Standard size: 200mm×400mm, 300mm×400mm; Customized size available;
Introduction:
LC1000 high thermal conductivity thermal pad is a high-performance heat conduction thermal interface material, which is made of imported raw materials. It is used to fill the air gap between the heating device and the heat sink or metal base. Their flexible and elastic characteristics enable it to cover completely uneven surfaces. The heat is transferred from the sep arated device or the whole PCB to the metal shell or the diffusion plate, which can effectively improve the heat dissipation performance and the efficiency and service life of the heating electronic components.
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  • Product introduction
  • Technical Parameters
  • Product Application
  • Product Characteristics
LC1000 high thermal conductivity thermal pad is a high-performance heat conduction thermal interface material, which is made of imported raw materials. It is used to fill the air gap between the heating device and the heat sink or metal base. Their flexible and elastic characteristics enable it to cover completely uneven surfaces. The heat is transferred from the sep arated device or the whole PCB to the metal shell or the diffusion plate, which can effectively improve the heat dissipation performance and the efficiency and service life of the heating electronic components.
Test item
 Unit LC1000 Test Method
Colour - Grey Visually
Thickness
 mm 0.5~5.0
 ASTM D374/374M
Hardness
 Shore AO
 20±5
 GB/T531
Hardness
 Shore OO
 70±10
 ASTM D2240
Specific gravity
 g/cm³
 3.65
 ASTM D792
Tensile Strength
 Mpa
 0.15
 ASTM D412
Elongation at break
 %
 15
 ASTM D412
Breakdown Voltage
 KV/mm
 ≥5
 ASTM D149
Volume resistivity
 Ω·cm
  1x1011
 ASTM D257
Temperature resistance range
 ℃
 -40~150
 -
Flame
 - V-0 UL 94
Weight loss
 %
 ≤0.5
 @150℃240H
Dielectric constant
 @1MHz
 7.32
 ASTM D150
Thermal conductivity
 W/m·k
 10.0
 ISO 22007-2
Thermal conductivity
 W/m·k
 10.0
 ASTM D5470
Thermal impedance
  ℃·in² /W
 0.167
 ASTM D5470
Thermal impedance
  ℃·in² /W
 1.077
 ASTM D5470
Specific Heat Capacity
  J/g/k
 0.786
 ASTM E1269

CPU / memory / high speed hard disk drive.
Microprocessors, memory chips and graphics processors.
Automobile engine control module.
Communication electronic hardware equipment.
Military electronic equipment.
Excellent thermal conductivity, high thermal conductivity, low thermal resistance.
High fit, soft and elastic.
High electrical insulation, protect sensitive electronic devices.
Natural stickiness, easy to assemble and disassemble.

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Tel:+86-13691979380

E-mail:ElvinLen@szutd.com

Address:Union Tenda Technology Park, No. 61, Zhangqi Road, Guixiang Community,Guanlan Street, Longhua District, Shenzhen