LE400V 4.0 W/m·K Screen-Printable Silicone Thermal Grease

LE400V is a high thermal conductivity silicone grease designed for high-power-density electronic assemblies. With a thermal conductivity of 4.0±0.3 W/m·K and a specified thermal impedance of 0.009 °C·in²/W, it supports heat transfer between electronic components and heat-spreading baseplates.

Suitable for screen printing, LE400V is intended for RF power amplifier (PA) modules in telecom base stations, high-end desktop CPUs and GPUs, and high-end workstations. It is an electrically non-insulating, non-curing formulation that can be removed during maintenance and rework.

Key Specifications

Features and Advantages

High thermal conductivity: 4.0±0.3 W/m·K supports heat transfer in high-power electronic equipment.
Low thermal impedance: Specified at 0.009 °C·in²/W, with a specified BLT of ≤20 μm for thin thermal interface designs.
Screen-printing compatibility: Suitable for applying patterned layers of thermal grease during electronics assembly.
Non-curing and reworkable: Can be removed to facilitate servicing, component replacement, and rework.
Electrically non-insulating: Intended for thermal interfaces where electrical insulation is not required.

Telecom base station RF PA modules: Provides thermal interface filling between PA devices and heat-spreading baseplates in high-power-density assemblies, including outdoor telecom equipment.
High-end desktop CPUs, GPUs, and workstations: Supports heat transfer between processors and cooling assemblies.
Serviceable electronic assemblies: The non-curing formulation facilitates removal during after-sales maintenance and rework.
Cost-sensitive consumer electronics: Offers a cost-effective alternative to phase change materials (PCMs) and thermal gels in applications suited to thermal grease.

Reliable thermal performance starts with the right materials.

With 15 years of expertise, Union Tenda provides thermal interface materials tailored to your applications—from thermal pads and gels to greases, potting compounds and phase change materials. Our in-house R&D and testing capabilities, backed by a 20,000 m² production base, support customers across electronics, AI, EVs and energy storage.

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