LE006 Silicone Thermal Grease for Processor Cooling
LE006 is a low thermal resistance silicone thermal grease designed for high-performance servers and supercomputing systems. With a specified thermal impedance of 0.008 °C·in²/W, it targets processor cooling interfaces where minimizing resistance to heat flow is a key design requirement.
An optimized filler particle size distribution and surface treatment help reduce contact thermal resistance between mating surfaces. This thermal paste for processor cooling combines 2.0±0.2 W/m·K thermal conductivity with a specified bond line thickness of ≤20 μm, supporting heat transfer across a thin interface layer.
Applied between processors and heat sinks, LE006 fills microscopic surface irregularities, helping reduce trapped air and improve thermal contact.
|
Test Items |
Unit |
LE006 |
Test Standard |
|
Appearance |
- |
Gray |
Visual |
|
Density |
g/cm3 |
2.87±0.2 |
ASTM D792 |
|
Bond Line Thickness (BLT) |
μm |
≤20 |
- |
|
Dielectric Strength |
KV/mm |
≥8 |
ASTM D149 |
|
Dielectric Constant |
- |
6.93 |
ASTM D150 |
|
Weight Loss |
% |
≤0.3 |
150℃ 240H |
|
Thermal Conductivity |
W/m·K |
2.0±0.2 |
ISO 22007-2 |
|
Thermal Conductivity |
W/m·K |
2.0±0.2 |
ASTMD5470(Three-Thickness Fit) |
|
Thermal Impedance |
℃·in²/W |
0.008 |
ASTM D5470（40psi@BLT） |
|
Thermal Impedance |
℃·cm²/W |
0.057 |
ASTM D5470（40psi@BLT ） |
|
Operating Temperature |
℃ |
-40~150 |
- |
|
Specific Heat Capacity |
J/(g/K) |
0.887 |
ASTM E1269 |
Broad operating temperature range: Operating temperature specification of −40 to 150 °C.
Typical Applications
Reliable thermal performance starts with the right materials.
With 15 years of expertise, Union Tenda provides thermal interface materials tailored to your applications—from thermal pads and gels to greases, potting compounds and phase change materials. Our in-house R&D and testing capabilities, backed by a 20,000 m² production base, support customers across electronics, AI, EVs and energy storage.
Let's connect to discuss your thermal management needs.
|
Test Items |
Unit |
LE006 |
Test Standard |
|
Appearance |
- |
Gray |
Visual |
|
Density |
g/cm3 |
2.87±0.2 |
ASTM D792 |
|
Bond Line Thickness (BLT) |
μm |
≤20 |
- |
|
Dielectric Strength |
KV/mm |
≥8 |
ASTM D149 |
|
Dielectric Constant |
- |
6.93 |
ASTM D150 |
|
Weight Loss |
% |
≤0.3 |
150℃ 240H |
|
Thermal Conductivity |
W/m·K |
2.0±0.2 |
ISO 22007-2 |
|
Thermal Conductivity |
W/m·K |
2.0±0.2 |
ASTMD5470(Three-Thickness Fit) |
|
Thermal Impedance |
℃·in²/W |
0.008 |
ASTM D5470（40psi@BLT） |
|
Thermal Impedance |
℃·cm²/W |
0.057 |
ASTM D5470（40psi@BLT ） |
|
Operating Temperature |
℃ |
-40~150 |
- |
|
Specific Heat Capacity |
J/(g/K) |
0.887 |
ASTM E1269 |
Typical Applications
- Thermal interface applications between heat-generating electronic components, such as integrated circuits (ICs), central processing units (CPUs), graphics processing units (GPUs), and LED lighting, and their heat sinks
- Thermal management for power modules and power semiconductors
- Thermal applications in automotive battery management systems (BMS) and engine control units (ECUs)
- Thermal applications in router and base station equipment
Features and Advantages
- Excellent wetting ability fills tiny surface irregularities to enhance heat transfer efficiency
- Low volatility, resists drying and powdering over extended use
- Precise viscosity, easy to spread and apply for convenient handling
- Non-corrosive, environmentally friendly, and non-toxic
Tel:+86-13691979380
+86-19065180554
E-mail:elvinlen@szutd.com
Carly@szutd.com
Address:8th Floor, Tower B, Lechuanghui Building, No. 1211 Guanguang Road, Longhua District, Shenzhen City, Guangdong Province
Send Request
Whatsapp
