LE003 Ultra-Low Thermal Resistance Grease for Servers and Supercomputers
LE003 silicone thermal grease is designed for high-performance servers and supercomputing systems with demanding thermal interface requirements. With a specified thermal impedance of 0.004 °C·in²/W, this high performance thermal grease supports cooling designs where reducing interface thermal resistance is a priority.
As a high thermal conductivity grease, LE003 offers 3.0±0.3 W/m·K thermal conductivity and a specified bond line thickness of ≤20 μm. The paste fills microscopic surface irregularities, helping reduce trapped air and improve thermal contact between processors and heat sinks.
|
Test Items |
Unit |
LE003 |
Test Standard |
|
Appearance |
- |
White/Gray |
Visual |
|
Density |
g/cm3 |
3.0±0.2 |
ASTM D792 |
|
Bond Line Thickness (BLT) |
μm |
≤20 |
- |
|
Dielectric Strength |
KV/mm |
≥8 |
ASTM D149 |
|
Dielectric Constant |
Ω·cm |
4.88 |
ASTM D150 |
|
Weight Loss |
% |
≤0.3 |
150℃ 240H |
|
Thermal Conductivity |
W/m·K |
3.0±0.3 |
ISO 22007-2 |
|
Thermal Conductivity |
W/m·K |
3.0±0.3 |
ASTMD5470(Three-Thickness Fit) |
|
Thermal Impedance |
℃·in²/W |
0.004 |
ASTM D5470（40psi@BLT） |
|
Thermal Impedance |
℃·cm²/W |
0.030 |
ASTM D5470（40psi@BLT ） |
|
Operating Temperature |
℃ |
-40~150 |
- |
|
Specific Heat Capacity |
J/(g/K) |
0.966 |
ASTM E1269 |
Broad operating temperature range: Operating temperature specification of −40 to 150 °C.
Typical Applications
Reliable thermal performance starts with the right materials.
With 15 years of expertise, Union Tenda provides thermal interface materials tailored to your applications—from thermal pads and gels to greases, potting compounds and phase change materials. Our in-house R&D and testing capabilities, backed by a 20,000 m² production base, support customers across electronics, AI, EVs and energy storage.
Let's connect to discuss your thermal management needs.
|
Test Items |
Unit |
LE003 |
Test Standard |
|
Appearance |
- |
White/Gray |
Visual |
|
Density |
g/cm3 |
3.0±0.2 |
ASTM D792 |
|
Bond Line Thickness (BLT) |
μm |
≤20 |
- |
|
Dielectric Strength |
KV/mm |
≥8 |
ASTM D149 |
|
Dielectric Constant |
Ω·cm |
4.88 |
ASTM D150 |
|
Weight Loss |
% |
≤0.3 |
150℃ 240H |
|
Thermal Conductivity |
W/m·K |
3.0±0.3 |
ISO 22007-2 |
|
Thermal Conductivity |
W/m·K |
3.0±0.3 |
ASTMD5470(Three-Thickness Fit) |
|
Thermal Impedance |
℃·in²/W |
0.004 |
ASTM D5470（40psi@BLT） |
|
Thermal Impedance |
℃·cm²/W |
0.030 |
ASTM D5470（40psi@BLT ） |
|
Operating Temperature |
℃ |
-40~150 |
- |
|
Specific Heat Capacity |
J/(g/K) |
0.966 |
ASTM E1269 |
Typical Applications
- Thermal interface applications between heat-generating electronic components, such as integrated circuits (ICs), central processing units (CPUs), graphics processing units (GPUs), and LED lighting, and their heat sinks
- Thermal management for power modules and power semiconductors
- Thermal applications in automotive battery management systems (BMS) and engine control units (ECUs)
- Thermal applications in router and base station equipment
Features and Advantages
- Excellent wetting ability fills tiny surface irregularities to enhance heat transfer efficiency
- Low volatility, resists drying and powdering over extended use
- Precise viscosity, easy to spread and apply for convenient handling
- Non-corrosive, environmentally friendly, and non-toxic
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