LE500V 5.0 W/m·K Silicone Thermal Grease for CPUs and GPUs

LE500V is a high thermal conductivity grease designed for high-power electronic equipment, high-end desktop CPUs and GPUs, and high-end workstations. With a thermal conductivity of 5.0±0.3 W/m·K and a specified thermal impedance of 0.008 °C·in²/W, it supports heat transfer between electronic components and cooling assemblies.

This silicone-based CPU/GPU thermal paste fills microscopic surface irregularities, helping reduce trapped air and improve thermal contact between components and heat sinks. Its non-curing formulation is easy to remove for servicing and rework, making it suitable for assemblies that require maintenance or component replacement.

LE500V is electrically non-insulating and intended for thermal interfaces where electrical insulation is not required.

Key Specifications

Features and Advantages

High thermal conductivity: 5.0±0.3 W/m·K supports heat transfer in demanding electronic cooling applications.

Low thermal impedance: Specified at 0.008 °C·in²/W, with a specified BLT of ≤20 μm for thin thermal interface designs.

Non-curing and reworkable: Easy to remove during after-sales maintenance, component replacement, and rework.

Electrically non-insulating: Suitable for assemblies that do not require electrical isolation at the thermal interface.

Cost-effective thermal management: Offers a cost-effective alternative to phase change materials (PCMs) and thermal gels in applications suited to thermal grease.

Typical Applications

-Thermal interfaces between components and heat sinks in high-power electronic equipment

Reliable thermal performance starts with the right materials.

With 15 years of expertise, Union Tenda provides thermal interface materials tailored to your applications—from thermal pads and gels to greases, potting compounds and phase change materials. Our in-house R&D and testing capabilities, backed by a 20,000 m² production base, support customers across electronics, AI, EVs and energy storage.

Let's connect to discuss your thermal management needs.