LE380 3.8 W/m·K High Thermal Conductivity Grease

LE380 silicone thermal grease is a high thermal conductivity grease designed for high-end desktop CPUs and GPUs, high-end workstations, and high-power electronic equipment. With a thermal conductivity of 3.8±0.3 W/m·K, it helps transfer heat from electronic components to heat sinks and cooling assemblies.

Used as a thermal paste for processor cooling, LE380 fills microscopic surface irregularities between mating surfaces, helping reduce trapped air and improve thermal contact. It provides a silicone-based thermal interface for desktop PC processor cooling, graphics cards, and workstation cooling assemblies.

Key Specifications

Features and Advantages

Broad operating temperature range: Operating temperature specification of −40 to 150 °C.

Typical Applications

-Thermal interfaces between components and heat sinks in high-power electronic equipment

Reliable thermal performance starts with the right materials.

With 15 years of expertise, Union Tenda provides thermal interface materials tailored to your applications—from thermal pads and gels to greases, potting compounds and phase change materials. Our in-house R&D and testing capabilities, backed by a 20,000 m² production base, support customers across electronics, AI, EVs and energy storage.

Let's connect to discuss your thermal management needs.