LE300 3.0 W/m·K High Performance Thermal Grease

LE300 silicone thermal grease is designed for performance-focused computing applications, including mainstream CPUs, GPUs, and general-purpose servers. With a thermal conductivity of 3.0±0.3 W/m·K, it helps transfer heat from electronic components to heat sinks and cooling assemblies.

This high thermal conductivity grease fills microscopic gaps between mating surfaces, helping displace trapped air and improve thermal contact. Applied at the component-to-heat-sink interface, LE300 helps reduce interface thermal resistance and supports effective processor cooling.

Key Specifications

Features and Advantages

Broad operating temperature range: Operating temperature specification of −40 to 150 °C.

Typical Applications

Thermal interfaces in high-performance computing equipment

Reliable thermal performance starts with the right materials.

With 15 years of expertise, Union Tenda provides thermal interface materials tailored to your applications—from thermal pads and gels to greases, potting compounds and phase change materials. Our in-house R&D and testing capabilities, backed by a 20,000 m² production base, support customers across electronics, AI, EVs and energy storage.

Let's connect to discuss your thermal management needs.