Thermal Grease
  • LE200 Thermal Grease
  • IMG_6189.JPG
  • IMG_6216.JPG
  • IMG_6229.JPG
  • IMG_6236.JPG
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  • LE200 Thermal Grease
  • IMG_6189.JPG
  • IMG_6216.JPG
  • IMG_6229.JPG
  • IMG_6236.JPG
  • IMG_6243.JPG

LE200 Thermal Grease

Specification:
Conventional packaging: 1kg / can, 5kg / can, 10kg / barrel, 20kg / barrel
Introduction:
Thermal conductive silicone grease has excellent thermal conductivity, good reliability, and reliable wettability on copper and aluminum surfaces. It issuitable for interface heat conduction of general CPU, GPU and other heatingpower devices. Because of its low viscosity, it can fully wet the contact surface and form a low interface thermal resistance, so it can quickly and efficiently transfer heat to the heat dissipation device and apply it on the assembly surface of power device and radiator to help eliminate the air gap on the contact surface, increase the heat flflow, reduce the thermal resistance, reduce the working temperature of power device, improve the reliability and prolong the service life.
  • Product introduction
  • Technical Parameters
  • Product Application
  • Product Characteristics
Thermal conductive silicone grease has excellent thermal conductivity, good reliability, and reliable wettability on copper and aluminum surfaces. It issuitable for interface heat conduction of general CPU, GPU and other heatingpower devices. Because of its low viscosity, it can fully wet the contact surface and form a low interface thermal resistance, so it can quickly and efficiently transfer heat to the heat dissipation device and apply it on the assembly surface of power device and radiator to help eliminate the air gap on the contact surface, increase the heat flflow, reduce the thermal resistance, reduce the working temperature of power device, improve the reliability and prolong the service life.
Test item
Unit
LE200
Test Methods
Color
- White/Gray
Visually
Continuous Use Temp

-40~150
-
Weight Loss
%
≤0.3
@150℃240H
Breakdown Voltage
KV/mm
≥10
ASTM D149
Volume Resistivity
Ω·cm
9*1011
ASTM D257
Dielectric Constant
@1MHz
5.78
ASTM D150
Dielectric Dissipation
@1MHz
6.49E-03
ASTM D150
Thermal Conductivity
W/m·K
2.0
ISO 22007-2
Thermal Impedance
℃-in2 /W
0.090
ASTM D5470

Between CPU / GPU and radiator
Between power supply resistor and bottom seat
Thermoelectric cooling device
Thermoelectric cooling device
LED lighting and other industries
The wettability of the surface can effectively reduce the thermal resistance of the interface
Low volatile, long-lasting paste state
Precision viscosity, easy to scrape, easy to operate
Environmental protection raw materials, no harmful gas release

Contact

Tel:+86-13691979380

E-mail:ElvinLen@szutd.com

Address:Union Tenda Technology Park, No. 61, Zhangqi Road, Guixiang Community,Guanlan Street, Longhua District, Shenzhen