LE200 2.0 W/m·K Silicone Thermal Grease for CPUs and GPUs

LE200 silicone thermal grease is a general-purpose thermal interface material for CPU and GPU cooling. With a thermal conductivity of 2.0±0.2 W/m·K, it supports heat transfer between electronic components and heat sinks, making it suitable for standard processor cooling applications.

Applied between the processor surface and heat sink, this CPU thermal grease fills microscopic surface gaps and helps displace trapped air. By improving thermal contact, LE200 helps reduce interface thermal resistance and transfer heat to the cooling assembly.

Key Specifications

Features and Advantages

Wide operating temperature range: Operating temperature specification of −40 to 150 °C.

Typical Applications

Electronic assemblies requiring silicone-based heat transfer grease

LE200 provides a general-purpose heat sink grease option for CPU, GPU, and related electronic cooling applications.

Reliable thermal performance starts with the right materials.

With 15 years of expertise, Union Tenda provides thermal interface materials tailored to your applications—from thermal pads and gels to greases, potting compounds and phase change materials. Our in-house R&D and testing capabilities, backed by a 20,000 m² production base, support customers across electronics, AI, EVs and energy storage.

Let's connect to discuss your thermal management needs.