LE100 silicone thermal grease is a cost-effective thermal interface material for low-power electronic components and cost-sensitive consumer electronics. With a thermal conductivity of 1.0±0.1 W/m·K, it helps transfer heat from electronic components to heat sinks while supporting practical OEM assembly needs.
Its low viscosity and excellent wetting performance allow the paste to spread easily across copper and aluminum surfaces, filling tiny surface irregularities and reducing air gaps at the interface. This thermally conductive grease helps reduce thermal resistance, lower component operating temperatures, and support reliable device performance.
|
Test Items |
Unit |
LE100 |
Test Standard |
|
Appearance |
- |
White |
Visual |
|
Density |
g/cm3 |
1.94±0.2 |
ASTM D792 |
|
Viscosity |
mPa.s |
100000±20000 |
ASTM E3116 |
|
Bond Line Thickness (BLT) |
μm |
≤20 |
- |
|
Dielectric Strength |
KV/mm |
≥6 |
ASTM D149 |
|
Dielectric Constant |
Ω·cm |
4.24 |
ASTM D150 |
|
Weight Loss |
% |
≤0.3 |
150℃ 240H |
|
Thermal Conductivity |
W/m·K |
1.0±0.1 |
ISO 22007-2 |
|
Thermal Conductivity |
W/m·K |
1.0±0.1 |
ASTMD5470(Three-Thickness Fit) |
|
Thermal Impedance |
℃·in²/W |
0.017 |
ASTM D5470（40psi@BLT） |
|
Thermal Impedance |
℃·cm²/W |
0.110 |
ASTM D5470（40psi@BLT ） |
|
Operating Temperature |
℃ |
-40~150 |
- |
|
Specific Heat Capacity |
J/(g/K) |
1.084 |
ASTM E1269 |
Non-corrosive formulation: Suitable for thermal interfaces involving copper and aluminum surfaces.
Low-power electronic modules in cost-sensitive OEM products
Reliable thermal performance starts with the right materials.
With 15 years of expertise, Union Tenda provides thermal interface materials tailored to your applications—from thermal pads and gels to greases, potting compounds and phase change materials. Our in-house R&D and testing capabilities, backed by a 20,000 m² production base, support customers across electronics, AI, EVs and energy storage.
Let's connect to discuss your thermal management needs.
|
Test Items |
Unit |
LE100 |
Test Standard |
|
Appearance |
- |
White |
Visual |
|
Density |
g/cm3 |
1.94±0.2 |
ASTM D792 |
|
Viscosity |
mPa.s |
100000±20000 |
ASTM E3116 |
|
Bond Line Thickness (BLT) |
μm |
≤20 |
- |
|
Dielectric Strength |
KV/mm |
≥6 |
ASTM D149 |
|
Dielectric Constant |
Ω·cm |
4.24 |
ASTM D150 |
|
Weight Loss |
% |
≤0.3 |
150℃ 240H |
|
Thermal Conductivity |
W/m·K |
1.0±0.1 |
ISO 22007-2 |
|
Thermal Conductivity |
W/m·K |
1.0±0.1 |
ASTMD5470(Three-Thickness Fit) |
|
Thermal Impedance |
℃·in²/W |
0.017 |
ASTM D5470（40psi@BLT） |
|
Thermal Impedance |
℃·cm²/W |
0.110 |
ASTM D5470（40psi@BLT ） |
|
Operating Temperature |
℃ |
-40~150 |
- |
|
Specific Heat Capacity |
J/(g/K) |
1.084 |
ASTM E1269 |
Typical Applications
- Thermal interface applications between heat-generating electronic components, such as integrated circuits (ICs), central processing units (CPUs), graphics processing units (GPUs), and LED lighting, and their heat sinks
- Thermal management for power modules and power semiconductors
- Thermal applications in automotive battery management systems (BMS) and engine control units (ECUs)
- Thermal applications in router and base station equipment
Features and Advantages
- Excellent wetting ability fills tiny surface irregularities to enhance heat transfer efficiency
- Low volatility, resists drying and powdering over extended use
- Precise viscosity, easy to spread and apply for convenient handling
- Non-corrosive, environmentally friendly, and non-toxic
Tel:+86-13691979380
+86-19065180554
E-mail:elvinlen@szutd.com
Carly@szutd.com
Address:8th Floor, Tower B, Lechuanghui Building, No. 1211 Guanguang Road, Longhua District, Shenzhen City, Guangdong Province
Send Request
Whatsapp
