LCE1200 One-Component Thermal Conductive Gel – 12 W/m·K

LCE1200 is a one-component thermal conductive gel designed for efficient heat transfer in high-power electronic devices. With a thermal conductivity of 12.0 ± 0.5 W/m·K, it fills gaps between heat-generating components and heat sinks or enclosures, supporting rapid heat dissipation and reliable thermal management.

This soft, paste-like thermal gap filler conforms to contact surfaces under low pressure, providing effective thermal conduction between mating surfaces. Its ready-to-use, single-component formulation requires no mixing, simplifying application and handling.

Combining thermal stability with electrical insulation, LCE1200 is suitable for applications that require both heat transfer and gap filling. It maintains stable performance across an operating temperature range of −40°C to 150°C, supporting efficient cooling and long-term device reliability.

Features and Advantages

Typical Applications

IC, CPU, GPU, and LED Cooling

Provides thermal conduction between heat-generating components—including integrated circuits (ICs), central processing units (CPUs), graphics processing units (GPUs), and LED lighting components—and heat sinks.

Power Modules and Power Semiconductors

Supports thermal management in power modules and power semiconductor devices.

Communication Base Stations, 5G Equipment, and Servers

Suitable for cooling electronic equipment with high heat loads, including communication base stations, 5G devices, and servers.

Solar Photovoltaic Modules

Provides thermal conduction in solar photovoltaic modules.