LCE1000 is a silicone-based, one-part thermal conductive gel designed for efficient thermal management in high-power electronic devices. With a thermal conductivity of 10.0 ± 0.5 W/m·K and a thermal impedance of 0.055 °C·in²/W, it provides an effective heat transfer interface between heat-generating components and heat sinks or enclosures.
Its soft, paste-like consistency enables it to conform to gaps and establish thermal contact under low assembly pressure. With a bond line thickness (BLT) specification of ≤300 μm, LCE1000 supports applications requiring both thermal conduction and gap filling. An extrusion rate of ≥20 g/min supports dispensing during application, while the single-component formulation requires no mixing and is ready to use.
Combining good electrical insulation with thermal stability across an operating temperature range of -40 to 150 °C, LCE1000 silicone thermal gel supports efficient cooling and long-term, stable operation in electronic devices.
|
Test Items |
Unit |
LCE1000 |
Test Standard |
|
Appearance |
- |
Gray |
Visual |
|
Density |
g/cm3 |
3.50±0.2 |
ASTM D792 |
|
Extrusion Rate |
g/min |
≥20 |
φ2.54mm/90psi |
|
BLT |
μm |
≤200 |
- |
|
Dielectric Strength |
KV/mm |
≥6 |
ASTM D149 |
|
Volume Resistivity |
Ω·cm |
≥1×1013 |
ASTM D257 |
|
Weight Loss |
% |
≤0.2 |
150℃240H |
|
Thermal Conductivity |
W/m·K |
10.0±0.5 |
ISO 22007-2 |
|
Thermal Conductivity |
W/m·K |
10.0±0.5 |
ASTM D5470(Three-Thickness Fit) |
|
Thermal Impedance |
℃·in²/W |
0.055 |
ASTM D5470(0.4mm ) |
|
Thermal Impedance |
℃·cm²/W |
0.356 |
ASTM D5470(0.4mm ) |
|
Operating Temperature |
℃ |
-40~150 |
- |
|
Specific Heat Capacity |
J/(g·K) |
0.784 |
ASTM E1269 |
Electrical insulation and thermal stability: Supports thermal management over an operating temperature range of -40 to 150 °C.

LCE1000 one-part thermal conductive gel is suitable for electronic assemblies requiring efficient heat transfer, electrical insulation, and gap filling between components and heat sinks or enclosures. Its conformable consistency makes it suitable for high-power electronic devices requiring thermal contact under low assembly pressure.
|
Test Items |
Unit |
LCE1000 |
Test Standard |
|
Appearance |
- |
Gray |
Visual |
|
Density |
g/cm3 |
3.50±0.2 |
ASTM D792 |
|
Extrusion Rate |
g/min |
≥20 |
φ2.54mm/90psi |
|
BLT |
μm |
≤200 |
- |
|
Dielectric Strength |
KV/mm |
≥6 |
ASTM D149 |
|
Volume Resistivity |
Ω·cm |
≥1×1013 |
ASTM D257 |
|
Weight Loss |
% |
≤0.2 |
150℃240H |
|
Thermal Conductivity |
W/m·K |
10.0±0.5 |
ISO 22007-2 |
|
Thermal Conductivity |
W/m·K |
10.0±0.5 |
ASTM D5470(Three-Thickness Fit) |
|
Thermal Impedance |
℃·in²/W |
0.055 |
ASTM D5470(0.4mm ) |
|
Thermal Impedance |
℃·cm²/W |
0.356 |
ASTM D5470(0.4mm ) |
|
Operating Temperature |
℃ |
-40~150 |
- |
|
Specific Heat Capacity |
J/(g·K) |
0.784 |
ASTM E1269 |
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