Thermal Gel
  • 10 W/m·K One-Part High Thermal Conductivity Thermal Conductive Gel
  • LCE1000 参数.png
  • EN-02-thermal 模板.png
  • EN-04-dispense 通用.png
  • 装配图.png
  • 10 W/m·K One-Part High Thermal Conductivity Thermal Conductive Gel
  • LCE1000 参数.png
  • EN-02-thermal 模板.png
  • EN-04-dispense 通用.png
  • 装配图.png

10 W/m·K One-Part High Thermal Conductivity Thermal Conductive Gel

Specification:
Thermal Conductivity:10.0±0.5 W/m·K
Thermal Impedance:0.055 ℃·in²/W
Extrusion Rate:≥20 g/min
BLT:≤300 μm
Operating Temperature:-40~150 ℃
Introduction:
LCE1000 one-part thermal conductive gel offers 10.0 ± 0.5 W/m·K thermal conductivity, electrical insulation, and low-pressure gap filling. No mixing required.
  • Product introduction
  • Technical Parameters
  • Product Application
  • Product Characteristics

LCE1000 One-Part Thermal Conductive Gel | 10 W/m·K

LCE1000 is a silicone-based, one-part thermal conductive gel designed for efficient thermal management in high-power electronic devices. With a thermal conductivity of 10.0 ± 0.5 W/m·K and a thermal impedance of 0.055 °C·in²/W, it provides an effective heat transfer interface between heat-generating components and heat sinks or enclosures.

Its soft, paste-like consistency enables it to conform to gaps and establish thermal contact under low assembly pressure. With a bond line thickness (BLT) specification of ≤300 μm, LCE1000 supports applications requiring both thermal conduction and gap filling. An extrusion rate of ≥20 g/min supports dispensing during application, while the single-component formulation requires no mixing and is ready to use.


Combining good electrical insulation with thermal stability across an operating temperature range of -40 to 150 °C, LCE1000 silicone thermal gel supports efficient cooling and long-term, stable operation in electronic devices.

Test Items

Unit

LCE1000

Test Standard

Appearance

-

Gray

Visual

Density

g/cm3

3.50±0.2

ASTM D792

Extrusion Rate

g/min

≥20

φ2.54mm/90psi

BLT

μm

≤200

-

Dielectric Strength

KV/mm

≥6

ASTM D149

Volume Resistivity

Ω·cm

≥1×1013

ASTM D257

Weight Loss

%

≤0.2

150℃240H

Thermal Conductivity

W/m·K

10.0±0.5

ISO 22007-2

Thermal Conductivity

W/m·K

10.0±0.5

ASTM D5470(Three-Thickness Fit)

Thermal Impedance

℃·in²/W

0.055

ASTM D5470(0.4mm )

Thermal Impedance

℃·cm²/W

0.356

ASTM D5470(0.4mm )

Operating Temperature

℃

-40~150

-

Specific Heat Capacity

J/(g·K)

0.784

ASTM E1269

Features and Advantages


High thermal conductivity: Provides 10.0 ± 0.5 W/m·K thermal conductivity for high-power electronic cooling.
Thermal interface performance: Offers a specified thermal impedance of 0.055 °C·in²/W.
Soft, conformable gap filling: Establishes contact between electronic components and cooling surfaces under low pressure.
Ready-to-use application: Requires no mixing and offers an extrusion rate of ≥20 g/min.

Electrical insulation and thermal stability: Supports thermal management over an operating temperature range of -40 to 150 °C.


Applications


LCE1000 one-part thermal conductive gel is suitable for electronic assemblies requiring efficient heat transfer, electrical insulation, and gap filling between components and heat sinks or enclosures. Its conformable consistency makes it suitable for high-power electronic devices requiring thermal contact under low assembly pressure.


Test Items

Unit

LCE1000

Test Standard

Appearance

-

Gray

Visual

Density

g/cm3

3.50±0.2

ASTM D792

Extrusion Rate

g/min

≥20

φ2.54mm/90psi

BLT

μm

≤200

-

Dielectric Strength

KV/mm

≥6

ASTM D149

Volume Resistivity

Ω·cm

≥1×1013

ASTM D257

Weight Loss

%

≤0.2

150℃240H

Thermal Conductivity

W/m·K

10.0±0.5

ISO 22007-2

Thermal Conductivity

W/m·K

10.0±0.5

ASTM D5470(Three-Thickness Fit)

Thermal Impedance

℃·in²/W

0.055

ASTM D5470(0.4mm )

Thermal Impedance

℃·cm²/W

0.356

ASTM D5470(0.4mm )

Operating Temperature

℃

-40~150

-

Specific Heat Capacity

J/(g·K)

0.784

ASTM E1269

Features and Advantages
-High thermal conductivity with excellent electrical insulation.
-Soft and moldable, easy to handle.
-Stable performance across high and low temperatures for long-term reliability.
-Non-volatile, non-corrosive, environmentally friendly, and non-toxic.



Typical Applications
-Used for thermal conduction between heat-generating electronic components like integrated circuits (ICs), central processing units (CPUs), graphics processing units (GPUs), and LED lighting and heat sinks.
-Applied in thermal management for power modules and power semiconductors.
-Suitable for cooling high-heat electronic equipment such as communication base stations, 5G devices, and servers.
-Used for thermal conduction in solar photovoltaic modules. 

Contact

Tel:+86-13691979380
+86-18126358702

E-mail:elvinlen@szutd.com
kacey@szutd.com

Address:8th Floor, Tower B, Lechuanghui Building, No. 1211 Guanguang Road, Longhua District, Shenzhen City, Guangdong Province