LCE200 is a silicone-based one component thermal gel designed for heat transfer and gap filling in electronic devices and electrical components. With a thermal conductivity of 2.0 ± 0.2 W/m·K, it fills gaps between components and heat sinks or enclosures to support effective thermal management.
This ready-to-use single part thermal gap filler requires no mixing. Its soft, paste-like consistency conforms to uneven surfaces under low pressure, helping reduce thermal contact resistance while minimizing mechanical stress on delicate components. Electrical insulation and thermal stability make LCE200 suitable for applications requiring both heat dissipation and gap filling.
Effective Heat Transfer: Thermal conductivity of 2.0 ± 0.2 W/m·K supports efficient heat dissipation.
Low Thermal Resistance: Helps transfer heat from components to heat sinks or enclosures.
Low Oil Bleed: Helps limit silicone oil migration.
Low Outgassing: Supports applications where volatile emissions are a concern.
Soft, Low-Stress Interface: Conforms under low pressure to reduce stress on sensitive components.
One-Component Convenience: Ready to use with no mixing required.
|
Test Items |
Unit |
LCE200 |
Test Standard |
|
Appearance |
- |
Blue |
Visual |
|
Density |
g/cm3 |
2.98±0.2 |
ASTM D792 |
|
Extrusion rate |
g/min |
≥40 |
φ2.54mm/90psi |
|
BLT |
μm |
≤20 |
- |
|
Dielectric Strength |
KV/mm |
≥7 |
ASTM D149 |
|
Volume Resistivity |
Ω·cm |
≥1×1013 |
ASTM D257 |
|
Weight Loss |
% |
≤0.3 |
150℃240H |
|
Thermal Conductivity |
W/m·K |
2.0±0.2 |
ISO 22007-2 |
|
Thermal Conductivity |
W/m·K |
2.0±0.2 |
ASTM D5470(Three-Thickness Fit) |
|
Thermal Impedance |
℃·in²/W |
0.090 |
ASTM D5470(0.1mm ) |
|
Thermal Impedance |
℃·cm²/W |
0.580 |
ASTM D5470(0.1mm ) |
|
Operating Temperature |
℃ |
-40~150 |
- |
|
Specific Heat Capacity |
J/(g/K) |
0.856 |
ASTM E1269 |
R&D & Innovation
Led by a postdoctoral researcher in polymer materials, our R&D team is supported by an in-house laboratory and testing center. With over 10 authorized invention patents, we deliver reliable materials backed by rigorous testing and quality control.
Advanced Manufacturing
Eight automated calendering lines, integrated mixing systems, and precision converting capabilities support consistent quality, large-scale supply, and customized solutions.
Quality & Compliance
Certified to ISO 9001, ISO 14001, ISO 45001, and IATF 16949, with products meeting RoHS, REACH, and UL requirements.
Comprehensive Product Portfolio
Thermal pads, gels, greases, RTV adhesives, potting compounds, insulating materials, ceramics, phase change materials, and graphite solutions.
Serving Global Industries
Supporting consumer electronics, AI, electric vehicles, energy storage, and communications, with long-term partnerships across leading global brands.
Your Trusted Partner in Thermal Management!
|
Test Items |
Unit |
LCE200 |
Test Standard |
|
Appearance |
- |
Blue |
Visual |
|
Density |
g/cm3 |
2.98±0.2 |
ASTM D792 |
|
Extrusion rate |
g/min |
≥40 |
φ2.54mm/90psi |
|
BLT |
μm |
≤20 |
- |
|
Dielectric Strength |
KV/mm |
≥7 |
ASTM D149 |
|
Volume Resistivity |
Ω·cm |
≥1×1013 |
ASTM D257 |
|
Weight Loss |
% |
≤0.3 |
150℃240H |
|
Thermal Conductivity |
W/m·K |
2.0±0.2 |
ISO 22007-2 |
|
Thermal Conductivity |
W/m·K |
2.0±0.2 |
ASTM D5470(Three-Thickness Fit) |
|
Thermal Impedance |
℃·in²/W |
0.090 |
ASTM D5470(0.1mm ) |
|
Thermal Impedance |
℃·cm²/W |
0.580 |
ASTM D5470(0.1mm ) |
|
Operating Temperature |
℃ |
-40~150 |
- |
|
Specific Heat Capacity |
J/(g/K) |
0.856 |
ASTM E1269 |
LCE200 provides a thermally conductive interface between electronic or electrical components and heat sinks, housings, or enclosures. Its soft consistency is suited to assemblies that require gap filling, electrical insulation, and low-pressure contact.
Effective Heat Transfer: Thermal conductivity of 2.0 ± 0.2 W/m·K supports efficient heat dissipation.
Low Thermal Resistance: Helps transfer heat from components to heat sinks or enclosures.
Low Oil Bleed: Helps limit silicone oil migration.
Low Outgassing: Supports applications where volatile emissions are a concern.
Soft, Low-Stress Interface: Conforms under low pressure to reduce stress on sensitive components.
One-Component Convenience: Ready to use with no mixing required.
Tel:+86-13691979380
+86-18126358702
E-mail:elvinlen@szutd.com
kacey@szutd.com
Address:8th Floor, Tower B, Lechuanghui Building, No. 1211 Guanguang Road, Longhua District, Shenzhen City, Guangdong Province