Thermal Gel
  • 2 W/m·K 0.090 ℃·in²/W One-part Non-Curing Silicone Thermal Conductive Gel
  • LCE200.png
  • EN-02-thermal 拷贝.png
  • IMG_2066 拷贝.jpg
  • EN-04-dispense 拷贝.png
  • 2 W/m·K 0.090 ℃·in²/W One-part Non-Curing Silicone Thermal Conductive Gel
  • LCE200.png
  • EN-02-thermal 拷贝.png
  • IMG_2066 拷贝.jpg
  • EN-04-dispense 拷贝.png

2 W/m·K 0.090 ℃·in²/W One-part Non-Curing Silicone Thermal Conductive Gel

Specification:
Excellent thermal conductivity
Stable performance
Soft, Low-Stress
Introduction:
Thermal Conductivity:2.0±0.2 W/m·K
Thermal Impedance:0.090 ℃·in²/W
Extrusion Rate:≥40 g/min
BLT:≤30 μm
Operating Temperature:-40~150 ℃
  • Product introduction
  • Technical Parameters
  • Product Application
  • Product Characteristics

LCE200 One Component Thermal Gel | Single Part Thermal Gap Filler


LCE200 is a silicone-based one component thermal gel designed for heat transfer and gap filling in electronic devices and electrical components. With a thermal conductivity of 2.0 ± 0.2 W/m·K, it fills gaps between components and heat sinks or enclosures to support effective thermal management.


This ready-to-use single part thermal gap filler requires no mixing. Its soft, paste-like consistency conforms to uneven surfaces under low pressure, helping reduce thermal contact resistance while minimizing mechanical stress on delicate components. Electrical insulation and thermal stability make LCE200 suitable for applications requiring both heat dissipation and gap filling.


Key Features

  • Effective Heat Transfer: Thermal conductivity of 2.0 ± 0.2 W/m·K supports efficient heat dissipation.

  • Low Thermal Resistance: Helps transfer heat from components to heat sinks or enclosures.

  • Low Oil Bleed: Helps limit silicone oil migration.

  • Low Outgassing: Supports applications where volatile emissions are a concern.

  • Soft, Low-Stress Interface: Conforms under low pressure to reduce stress on sensitive components.

  • One-Component Convenience: Ready to use with no mixing required.



Test Items

Unit

LCE200

Test Standard

Appearance

-

Blue

Visual

Density

g/cm3

2.98±0.2

ASTM D792

Extrusion rate

g/min

≥40

φ2.54mm/90psi

BLT

μm

≤20

-

Dielectric Strength

KV/mm

≥7

ASTM D149

Volume Resistivity

Ω·cm

≥1×1013

ASTM D257

Weight Loss

%

≤0.3

150℃240H

Thermal Conductivity

W/m·K

2.0±0.2

ISO 22007-2

Thermal Conductivity

W/m·K

2.0±0.2

ASTM D5470(Three-Thickness Fit)

Thermal Impedance

℃·in²/W

0.090

ASTM D5470(0.1mm )

Thermal Impedance

℃·cm²/W

0.580

ASTM D5470(0.1mm )

Operating Temperature

℃

-40~150

-

Specific Heat Capacity

J/(g/K)

0.856

ASTM E1269




15 Years of Expertise in Thermal Management



Union Tenda is a National High-tech Enterprise specializing in thermal interface materials and one-stop thermal management solutions. With a 2,000 m² office in Shenzhen, a 20,000 m² production base in Huizhou, and a 200-member team, we combine strong R&D capabilities with automated manufacturing to serve customers worldwide.




R&D & Innovation
Led by a postdoctoral researcher in polymer materials, our R&D team is supported by an in-house laboratory and testing center. With over 10 authorized invention patents, we deliver reliable materials backed by rigorous testing and quality control.

Advanced Manufacturing  
Eight automated calendering lines, integrated mixing systems, and precision converting capabilities support consistent quality, large-scale supply, and customized solutions.

Quality & Compliance
Certified to ISO 9001, ISO 14001, ISO 45001, and IATF 16949, with products meeting RoHS, REACH, and UL requirements.

Comprehensive Product Portfolio  
Thermal pads, gels, greases, RTV adhesives, potting compounds, insulating materials, ceramics, phase change materials, and graphite solutions.

Serving Global Industries  
Supporting consumer electronics, AI, electric vehicles, energy storage, and communications, with long-term partnerships across leading global brands.

Your Trusted Partner in Thermal Management!

Test Items

Unit

LCE200

Test Standard

Appearance

-

Blue

Visual

Density

g/cm3

2.98±0.2

ASTM D792

Extrusion rate

g/min

≥40

φ2.54mm/90psi

BLT

μm

≤20

-

Dielectric Strength

KV/mm

≥7

ASTM D149

Volume Resistivity

Ω·cm

≥1×1013

ASTM D257

Weight Loss

%

≤0.3

150℃240H

Thermal Conductivity

W/m·K

2.0±0.2

ISO 22007-2

Thermal Conductivity

W/m·K

2.0±0.2

ASTM D5470(Three-Thickness Fit)

Thermal Impedance

℃·in²/W

0.090

ASTM D5470(0.1mm )

Thermal Impedance

℃·cm²/W

0.580

ASTM D5470(0.1mm )

Operating Temperature

℃

-40~150

-

Specific Heat Capacity

J/(g/K)

0.856

ASTM E1269

Applications

LCE200 provides a thermally conductive interface between electronic or electrical components and heat sinks, housings, or enclosures. Its soft consistency is suited to assemblies that require gap filling, electrical insulation, and low-pressure contact.

Key Features

  • Effective Heat Transfer: Thermal conductivity of 2.0 ± 0.2 W/m·K supports efficient heat dissipation.

  • Low Thermal Resistance: Helps transfer heat from components to heat sinks or enclosures.

  • Low Oil Bleed: Helps limit silicone oil migration.

  • Low Outgassing: Supports applications where volatile emissions are a concern.

  • Soft, Low-Stress Interface: Conforms under low pressure to reduce stress on sensitive components.

  • One-Component Convenience: Ready to use with no mixing required.

Contact

Tel:+86-13691979380
+86-18126358702

E-mail:elvinlen@szutd.com
kacey@szutd.com

Address:8th Floor, Tower B, Lechuanghui Building, No. 1211 Guanguang Road, Longhua District, Shenzhen City, Guangdong Province