LCF500 Two-Component Thermally Conductive Gel | 5.0 W/m·K

Dispensable Thermal Gap Filler for Electronics Cooling

LCF500 is a two-component thermally conductive gel designed to transfer heat between electronic components and heat dissipation structures. With a thermal conductivity of 5.0 ± 0.3 W/m·K, it combines effective heat transfer, electrical insulation, and conformable gap filling for electronic thermal management.

Applied as a dispensable material, LCF500 conforms to irregular surfaces and fills gaps caused by component height differences and assembly tolerances. This helps increase the effective contact area and reduce thermal contact resistance.

The material cures at room temperature or elevated temperatures, forming a soft, low-modulus thermally conductive elastomer. Once cured, it provides a compliant thermal interface similar to a thermal silicone pad, with cushioning and support for the assembly.

Features and Advantages

Effective Heat Transfer with Electrical Insulation

LCF500 provides a thermally conductive path between heat-generating components and cooling structures while offering electrical insulation properties. Its conformability helps minimize interfacial air gaps that can restrict heat transfer.

Reduced Stress on Electronic Components

The low-modulus cured material helps limit mechanical stress on sensitive components. Its compliant structure also provides cushioning and accommodates dimensional variations within the assembly.

Adaptable to Uneven Gaps

LCF500 can be dispensed to suit different surface profiles, component layouts, and gap dimensions. It is particularly useful for thermal modules where mating surfaces are uneven or component heights vary.

Compatible with Automated Dispensing

Designed for automated metering, mixing, and dispensing, LCF500 supports controlled material application. Dispensing volume and pattern can be adjusted to match the thermal interface geometry and production requirements.

Room-Temperature or Heat-Accelerated Curing

LCF500 can cure at room temperature or undergo accelerated curing at elevated temperatures, providing flexibility when integrating the material into an assembly process.

Typical Applications

LCF500 is suitable for thermal interface applications requiring conformable gap filling, electrical insulation, and low assembly stress, including:

• Networking and 5G communication equipment: thermal interfaces in network terminals, communication base stations, and 5G devices.

• Power electronics: heat transfer between power modules, power semiconductors, and cooling structures.

• Servers and other high-heat-generating electronics: gap filling between electronic components and heat dissipation assemblies.

• Battery management systems: thermal management of BMS electronic components.

• Home appliances and industrial equipment: heat conduction across component-to-cooling interfaces.

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Discuss Your Application

Contact us for the LCF500 technical data sheet and assistance evaluating gap dimensions, dispensing requirements, curing conditions, and thermal interface suitability.