LCF300 Two-Component Thermally Conductive Gel | 3.0 W/m·K

Curable Thermal Gap Filler for Variable-Gap Assemblies

LCF300 is a two-component thermally conductive gel with a thermal conductivity of 3.0 ± 0.3 W/m·K. Applied in a dispensable form, it fills gaps between electronic components and cooling structures, creating a conformable path for heat transfer.

The material conforms to surface contours before curing, helping improve contact across uneven interfaces and accommodate differences in component height. It then cures at room temperature or elevated temperatures to form a soft, thermally conductive elastomer. The cured interface functions similarly to a thermal silicone pad while retaining the application flexibility of a dispensed gap filler.

Designed for Dimensional Variations

Component tolerances and irregular mating surfaces can create gaps that interrupt thermal contact. LCF300 fills these spaces during application, helping increase the effective contact area and reduce thermal contact resistance.

Its compliant cured structure accommodates assembly variations and helps limit mechanical stress on electronic components. This makes it suitable for thermal modules where gap thickness varies across the assembly.

Key Product Benefits

• Thermal conductivity of 3.0 ± 0.3 W/m·K: supports heat transfer between heat-generating components and cooling structures.

• Conformable thermal contact: fills uneven gaps and follows mating surface contours before curing.

• Soft elastomer after curing: provides a flexible thermal interface with a hardness of 50 ± 10 Shore OO.

• Automated dispensing compatibility: supports controlled material placement, with dispensing patterns and volumes adjusted to the assembly design.

• Flexible curing options: cures at room temperature or elevated temperatures to suit processing requirements.