LCF800 Two-Component Thermally Conductive Gel | 8.0 W/m·K

Dispensable Thermal Gap Filler for Electronic Assemblies

LCF800 is a two-component thermally conductive gel designed to fill gaps between electronic components and heat dissipation structures. With a thermal conductivity of 8.0 ± 0.3 W/m·K, it provides a conductive heat transfer path for electronic assemblies requiring efficient thermal management.

The material cures at room temperature or elevated temperatures to form a soft, thermally conductive elastomer. Before curing, it conforms to irregular mating surfaces and accommodates variations in gap thickness, helping improve surface contact and reduce thermal contact resistance. Once cured, it forms a compliant thermal interface similar to a thermal silicone pad.

Designed for automated metering, mixing, and dispensing, LCF800 supports controlled material placement across different component layouts and assembly geometries.

Key Features and Benefits

High Thermal Conductivity

A thermal conductivity of 8.0 ± 0.3 W/m·K supports heat transfer from heat-generating components to heat sinks, cooling plates, and other thermal management structures.

Low Thermal Resistance

LCF800 conforms to mating surfaces to help minimize interfacial air gaps and improve thermal contact. Its reported thermal resistance is 0.283 °C·in²/W under the applicable test conditions.

Low Oil Bleed

The low oil bleed formulation helps limit oil migration around the thermal interface, supporting cleaner electronic assemblies.

Low Assembly Stress

The compliant material accommodates dimensional tolerances and helps reduce mechanical stress on sensitive components during assembly.

Flexible Gap Filling

Its dispensable form allows the applied volume and pattern to be adjusted for uneven surfaces, complex geometries, and variations in component height.

Suitable for Automated Production

Two-component dispensing enables controlled application and integration into automated assembly processes. Room-temperature and heat-accelerated curing options provide flexibility in production planning.

Typical Applications

LCF800 is suitable for evaluation in electronic assemblies requiring high thermal conductivity, low oil bleed, and conformable gap filling, including:

• Interfaces between electronic components and heat sinks or cooling plates

• Power electronics and control modules

• Thermal modules with uneven mating surfaces

• Assemblies with varying component heights or gap dimensions

• Production lines using automated thermal interface material dispensing

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Discuss Your Thermal Interface Requirements

Contact us for the LCF800 technical data sheet and to discuss gap dimensions, dispensing requirements, curing conditions, and application suitability.