The LCF600 two-component thermal conductive gel is a preformed thermal gap filler material that can cure through a reaction at room temperature or high temperature, forming a soft, thermally conductive elastomer. It conforms to structural shapes and, once fully cured, functions similarly to a thermal silicone pad.
Designed to meet the low-pressure, high-compression modulus requirements during product use, it supports automated dispensing for high efficiency. It ensures good contact with electronic assemblies, enhancing the effective contact area and reducing thermal contact resistance.
Its ability to automatically fill gaps and provide unlimited compression makes it ideal for thermal modules or electronic components with significant thickness variations.
|
Test Items |
Unit |
LCF600 |
Test Standard |
|
Appearance |
- |
A White/ B Gray |
Visual |
|
Mixing Ratio |
- |
1:1 |
- |
|
Surface Drying Time |
min |
30~60 |
ASTM C679 |
|
Hardness |
Shore AO |
30±5 |
ISO 48-4 |
|
Hardness |
Shore OO |
70±10 |
ASTM D2240 |
|
Density |
g/cm3 |
3.26±0.2 |
ASTM D792 |
|
Extrusion Rate |
g/min |
≥15 |
Φ1.85mm/90psi |
|
Dielectric Strength |
KV/mm |
≥7 |
ASTM D149 |
|
Volume Resistivity |
Ω·cm |
≥1×1012 |
ASTM D257 |
|
Weight Loss |
% |
≤0.3 |
150℃240H |
|
Thermal Conductivity |
W/m·K |
6.0±0.3 |
ISO 22007-2 |
|
Thermal Conductivity |
W/m·K |
6.0±0.3 |
ASTM D5470（Three-Thickness Fit） |
|
Thermal Resistance |
℃·in²/W |
0.318 |
ASTM D5470（1mm ） |
|
Thermal Resistance |
℃·cm²/W |
2.050 |
ASTM D5470（1mm ） |
|
Flame Rating |
Grade |
V-0 |
UL94 |
|
Operating Temperature |
℃ |
-40~150 |
- |
|
Specific Heat Capacity |
J/（g·K） |
0.821 |
ASTM E1269 |
-Lower assembly stress, easy to handle
-High reliability; once cured, it functions like a thermal pad and is environmentally friendly with no volatile compounds
-Supports automated dispensing with adjustable dimensions
-Low modulus after curing, providing some support and shock absorption
-Thermal management for power modules and power semiconductors
-Heat dissipation for high-heat-generating electronic devices, such as communication base stations, 5G devices, and servers
-Thermal management for battery management systems
-Heat conduction in home appliances and industrial equipment
|
Test Items |
Unit |
LCF600 |
Test Standard |
|
Appearance |
- |
A White/ B Gray |
Visual |
|
Mixing Ratio |
- |
1:1 |
- |
|
Surface Drying Time |
min |
30~60 |
ASTM C679 |
|
Hardness |
Shore AO |
30±5 |
ISO 48-4 |
|
Hardness |
Shore OO |
70±10 |
ASTM D2240 |
|
Density |
g/cm3 |
3.26±0.2 |
ASTM D792 |
|
Extrusion Rate |
g/min |
≥15 |
Φ1.85mm/90psi |
|
Dielectric Strength |
KV/mm |
≥7 |
ASTM D149 |
|
Volume Resistivity |
Ω·cm |
≥1×1012 |
ASTM D257 |
|
Weight Loss |
% |
≤0.3 |
150℃240H |
|
Thermal Conductivity |
W/m·K |
6.0±0.3 |
ISO 22007-2 |
|
Thermal Conductivity |
W/m·K |
6.0±0.3 |
ASTM D5470（Three-Thickness Fit） |
|
Thermal Resistance |
℃·in²/W |
0.318 |
ASTM D5470（1mm ） |
|
Thermal Resistance |
℃·cm²/W |
2.050 |
ASTM D5470（1mm ） |
|
Flame Rating |
Grade |
V-0 |
UL94 |
|
Operating Temperature |
℃ |
-40~150 |
- |
|
Specific Heat Capacity |
J/（g·K） |
0.821 |
ASTM E1269 |
-Thermal management for power modules and power semiconductors
-Heat dissipation for high-heat-generating electronic devices, such as communication base stations, 5G devices, and servers
-Thermal management for battery management systems
-Heat conduction in home appliances and industrial equipment
-Lower assembly stress, easy to handle
-High reliability; once cured, it functions like a thermal pad and is environmentally friendly with no volatile compounds
-Supports automated dispensing with adjustable dimensions
-Low modulus after curing, providing some support and shock absorption
Tel:+86-13691979380
+86-18126358702
E-mail:elvinlen@szutd.com
kacey@szutd.com
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