Thermal Gel
  • 3.8 W/m·K Two Part Liquid Gap Filler Thermal Putty Thermally Conductive Gel
  • LCF380.png
  • 未标题-1 拷贝.jpg
  • 应用.jpg
  • 3.8 W/m·K Two Part Liquid Gap Filler Thermal Putty Thermally Conductive Gel
  • LCF380.png
  • 未标题-1 拷贝.jpg
  • 应用.jpg

3.8 W/m·K Two Part Liquid Gap Filler Thermal Putty Thermally Conductive Gel

Specification:
Low Oil Bleed
High Thermal Conductivity
Low Thermal Resistance
Low Stress
Introduction:
3.8 W/m·K Two-component Thermal Conductive Gel
Thermal Conductivity: 3.8±0.3 W/m·K
Thermal Resistance: 0.800 ℃·in²/W
Hardness: 55±10 Shore OO
Density:1.94±0.2 g/cm3
  • Product introduction
  • Technical Parameters
  • Product Application
  • Product Characteristics

LCF380 Two-Part Thermally Conductive Gel | 3.0 W/m·K Liquid Gap Filler

LCF380 is a two-part, dispensable thermal gap filler with a nominal thermal conductivity of 3.8 W/m·K. Designed for electronic thermal management, it fills gaps between heat-generating components and cooling structures to create a conformable thermal interface.

After the two components are mixed, the material begins curing and forms a soft, thermally conductive elastomer. It can cure at room temperature or undergo accelerated curing at elevated temperatures. Once cured, it provides a compliant interface similar to a thermal silicone pad while accommodating complex geometries and variations in gap thickness.

Before curing, LCF380 conforms to mating surfaces, helping increase the effective contact area and reduce thermal contact resistance. Its low-modulus cured structure helps limit assembly stress on sensitive electronic components.

Test Items

Unit

LCF380

Test Standard

Appearance

-

A White/ B Pink

Visual

Mixing Ratio

-

1:1

-

Surface Drying Time

min

30~60

ASTM C679

Hardness

Shore AO

20±5

ISO 48-4

Hardness

Shore OO

50±10

ASTM D2240

Density

g/cm3

3.13±0.2

ASTM D792

Extrusion Rate

g/min

≥40

Φ1.85mm/90psi

Dielectric Strength

KV/mm

≥7

ASTM D149

Volume Resistivity

Ω·cm

≥1×1012

ASTM D257

Weight Loss

%

≤0.3

150℃240H

Thermal Conductivity

W/m·K

3.8±0.3

ISO 22007-2

Thermal Conductivity

W/m·K

3.8±0.3

ASTM D5470(Three-Thickness Fit)

Thermal Resistance

℃·in²/W

0.430

ASTM D5470(1mm )

Thermal Resistance

℃·cm²/W

2.775

ASTM D5470(1mm )

Flame Rating

Grade

V-0

UL94

Operating Temperature

℃

-40~150

-

Specific Heat Capacity

J/(g·K)

0.712

ASTM E1269


Key Features and Benefits

Efficient Thermal Transfer

With a nominal thermal conductivity of 3.8 W/m·K, LCF380 supports heat transfer between electronic components and heat sinks, cold plates, or other cooling structures.

Conformable Gap Filling

The dispensable material fills uneven gaps and accommodates dimensional tolerances, making it suitable for assemblies with varying component heights or irregular contact surfaces.

Soft, Compliant Performance After Curing

LCF380 cures into a flexible elastomer that maintains conformable thermal contact and provides cushioning and support within the assembly.

Compatible with Automated Production

Two-component metering, mixing, and dispensing enable controlled material application. Dispensing volume and pattern can be adjusted to suit component layouts and production requirements.

Flexible Curing Options

Room-temperature curing offers process flexibility, while heat-accelerated curing can help shorten production cycles. The supplied processing guidance indicates a heating time of 10–60 minutes; the required curing conditions depend on temperature, material thickness, and the specified cure endpoint.

Electrical Insulation and Temperature Resistance

LCF380 combines thermal conductivity with electrical insulation properties and a specified operating temperature range of −40°C to +150°C.

Application Areas

LCF380 is intended for thermal interface applications requiring automated dispensing, variable-gap accommodation, and low mechanical stress. Potential applications include:

  • Electric vehicle electronic assemblies

  • Energy storage system electronics

  • Power electronics and control modules

  • Thermal modules with uneven mating surfaces or varying component heights

Suitability for a specific assembly should be established through application testing, including thermal performance, material compatibility, and reliability under the intended operating conditions.


Test Items

Unit

LCF380

Test Standard

Appearance

-

A White/ B Pink

Visual

Mixing Ratio

-

1:1

-

Surface Drying Time

min

30~60

ASTM C679

Hardness

Shore AO

20±5

ISO 48-4

Hardness

Shore OO

50±10

ASTM D2240

Density

g/cm3

3.13±0.2

ASTM D792

Extrusion Rate

g/min

≥40

Φ1.85mm/90psi

Dielectric Strength

KV/mm

≥7

ASTM D149

Volume Resistivity

Ω·cm

≥1×1012

ASTM D257

Weight Loss

%

≤0.3

150℃240H

Thermal Conductivity

W/m·K

3.8±0.3

ISO 22007-2

Thermal Conductivity

W/m·K

3.8±0.3

ASTM D5470(Three-Thickness Fit)

Thermal Resistance

℃·in²/W

0.430

ASTM D5470(1mm )

Thermal Resistance

℃·cm²/W

2.775

ASTM D5470(1mm )

Flame Rating

Grade

V-0

UL94

Operating Temperature

℃

-40~150

-

Specific Heat Capacity

J/(g·K)

0.712

ASTM E1269

Features and Advantages


-High thermal conductivity, low thermal resistance, and good insulation properties
-Lower assembly stress, easy to handle
-High reliability; once cured, it functions like a thermal pad and is environmentally friendly with no volatile compounds
-Supports automated dispensing with adjustable dimensions
-Low modulus after curing, providing some support and shock absorption
Typical Applications
-Thermal management for network terminals and 5G communication equipment
-Thermal management for power modules and power semiconductors
-Heat dissipation for high-heat-generating electronic devices, such as communication base stations, 5G devices, and servers
-Thermal management for battery management systems
-Heat conduction in home appliances and industrial equipment

Contact

Tel:+86-13691979380
+86-18126358702

E-mail:elvinlen@szutd.com
kacey@szutd.com

Address:8th Floor, Tower B, Lechuanghui Building, No. 1211 Guanguang Road, Longhua District, Shenzhen City, Guangdong Province