LCF200D Two-Component Thermally Conductive Gel

2.0 W/m·K Dispensable Thermal Gap Filler

LCF200D is a two-component thermally conductive gel designed to fill gaps between electronic components and heat dissipation structures. It cures at room temperature or elevated temperatures to form a soft, thermally conductive elastomer, providing a conformable thermal interface similar to a silicone thermal pad.

With a thermal conductivity of 2.0 ± 0.2 W/m·K, LCF200D helps transfer heat across uneven surfaces and variable gaps. Its dispensable form allows it to conform to complex geometries, improve surface contact, and reduce thermal contact resistance.

 Features and Benefits

Effective Heat Transfer and Electrical Insulation

LCF200D combines thermal conductivity with electrical insulation properties, making it suitable for thermal interface applications in electronic assemblies.

Low Modulus and Reduced Assembly Stress

The cured material forms a soft, low-modulus elastomer that accommodates dimensional variations and helps reduce pressure on sensitive components. It also provides cushioning and mechanical support.

Automated Dispensing for Efficient Production

Designed for automated dispensing, this two-part thermal gap filler allows manufacturers to adjust the dispensing pattern and material volume to suit different component layouts and gap dimensions.

Conformable Gap Filling

Before curing, LCF200D conforms to irregular surfaces and fills gaps of varying thicknesses. This helps increase the effective contact area between components and cooling structures.

Soft, Pad-Like Performance After Curing

Once fully cured, LCF200D provides a flexible thermal interface with performance characteristics similar to a thermal silicone pad, combining the application flexibility of a dispensable gel with a soft elastomeric structure.

Thermal Interface Applications

LCF200D is designed for electronic assemblies and thermal modules with uneven surfaces or variable gap thicknesses. It is particularly useful where automated material application, low assembly stress, and conformable thermal contact are required.

For manufacturers seeking a dispensable thermal interface material, LCF200D offers a practical combination of heat transfer, electrical insulation, and soft cured performance.