Thermal Gel
  • LCF200  Two Component Thermal Conductive Gel
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  • LCF200  Two Component Thermal Conductive Gel
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LCF200 Two Component Thermal Conductive Gel

Specification:
50ml, 100ml, 400ml or Customized
Introduction:
Two component thermal conductive gel is a preformed thermal gap filling material, which can be solidified at room temperature or high temperature to form a flexible and thermally conductive elastomer, which is formed with the shape of the structure. After curing, it is equivalent to the thermal conductive silicone gasket. It mainly meets the requirements of low pressure and high compression modulus. It can realize automatic dispensing production with high efficiency. It has good contact with electronic products, increases effective contact area and reduces contact thermal resistance. It can automatically fill the gap and compress infinitely. It is suitable for heat dissipation modules or electronic components with large thickness variation.
  • Product introduction
  • Technical Parameters
  • Product Application
  • Product Characteristics
Two component thermal conductive gel is a preformed thermal gap filling material, which can be solidified at room temperature or high temperature to form a flexible and thermally conductive elastomer, which is formed with the shape of the structure. After curing, it is equivalent to the thermal conductive silicone gasket. It mainly meets the requirements of low pressure and high compression modulus. It can realize automatic dispensing production with high efficiency. It has good contact with electronic products, increases effective contact area and reduces contact thermal resistance. It can automatically fill the gap and compress infinitely. It is suitable for heat dissipation modules or electronic components with large thickness variation.
Test Item Unit
LCF200 Test Methods
Color A/B
- White + Blue
Visual
Extrusion Rate
g/min
20
90psi@φ1.85mm
Mixing ratio
- 1:1 ASTM D149
Hardness
Shore AO
20±5
GB/T531
Hardness
Shore OO
50±10
ASTM D2240
Specific Gravity
g/cm3 2.75
ASTM D792
Breakdown Voltage
KV/mm
≥10
ASTM D149
Volume Resistivity
Ω·cm
1×1012
ASTM D257
Weight Loss
% ≤0.3
@150℃240H
Continuous Use Temp

-40~150
-
Flame Rating
- V-0 UL-94
Surface dry time
min 45 ASTM C679
Thermal Conductivity
W/m·K
2.0±0.2
ISO 22007
Thermal Conductivity
W/m·K
2.0±0.2
ASTM D5470
Thermal Impedance
℃·in2/W
1.28
ASTM D5470
Thermal Impedance
℃·cm2/W
8.256
ASTM D5470
Specific Heat Capacity
J/g/k
0.964
ASTM E1269

Network terminal /5G mobile phone communication
New energy battery
Automotive electronic application equipment
Electronic medical / power equipment
Between fragile components and housing

High thermal conductivity, low thermal resistance, good wettability
Lower assembly stress, easy to operate
High reliability, after curing, it is equivalent to thermal pad, no volatilization
Automatic dispensing adjustment of any thickness
After curing, the modulus is low, which greatly reduces the stress caused by thermal expansion and the damage caused by vibration

Contact

Tel:+86-13691979380

E-mail:ElvinLen@szutd.com

Address:Union Tenda Technology Park, No. 61, Zhangqi Road, Guixiang Community,Guanlan Street, Longhua District, Shenzhen