High thermal conductivity silicon film is a kind of thin thermal conductive insulating material with excellent comprehensive properties, which is synthesized by special process with glass fiber as the base material, thermal conductive powder and high molecular polymer. This material has the advantages of high thermal conductivity, high friction resistance, high tensile strength and smooth and high adhesion surface, which can greatly reduce the interface thermal resistance under low pressure. It is widely used in the situation of high thermal conductivity and high electrical insulation. It is suitable for fixing components with low tightening pressure. It is mainly used between the heating semiconductor device and the heat dissipation substrate for heat conduction and insulation.