Thermal Potting Compound
  • 0.6 W/m·K RTV Silicone Potting Adhesive Thermal Glue
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  • 0.6 W/m·K RTV Silicone Potting Adhesive Thermal Glue
  • LCF1901.png
  • IMG_2126.JPG
  • 主图.jpg
  • 主图 2.png

0.6 W/m·K RTV Silicone Potting Adhesive Thermal Glue

Specification:
LCF1901 RTV Silicone Adhesive
Thermal conductivity:0.6±0.06 W/m·K
Breakdown voltage:≥15 KV/mm
Hardness:60±5 Shore A
Tensile strength:≥2.0 MPa
Operating Temperature:-60~200℃
Introduction:
LCF1901 is an RTV silicone adhesive for applications that combine bonding, sealing, heat transfer, and electrical insulation. With a thermal conductivity of 0.6 ± 0.06 W/m·K and a dielectric strength of at least 15 kV/mm, LCF1901 is a candidate for electronic and industrial assemblies requiring heat transfer across an electrically insulating bond line. Its specified operating temperature range is −60°C to +200°C.
  • Product introduction
  • Technical Parameters
  • Product Application
  • Product Characteristics

LCF1901 RTV Silicone Adhesive


Thermally conductive silicone adhesive sealant for component bonding and assembly protection.


LCF1901 is an RTV silicone adhesive for applications that combine bonding, sealing, heat transfer, and electrical insulation. It cures at room temperature to form a silicone elastomer with a hardness of 60 ± 5 Shore A, providing a firmer cured material for assemblies where component support and joint stability are important.


With a thermal conductivity of 0.6 ± 0.06 W/m·K and a dielectric strength of at least 15 kV/mm, LCF1901 is a candidate for electronic and industrial assemblies requiring heat transfer across an electrically insulating bond line. Its specified operating temperature range is −60°C to +200°C.


Technical Specifications

Test Items

Unit

LCF1901

Test Standard

Before curing

Appearance

-

White/semiflowable

Visual

 

Density

g/cm3

1.65±0.1

ASTM D792

 

Extrusion rate

g/min

>1200

φ3.18mm/0.62MPa

 

Surface Drying Time(25℃)

min

5-15

ASTM D2377

 

Full cure time

d

3-7

-

 

Curing type

-

Single-component, methanol-releasing type

-

After curing

Tensile strength

MPa

≥2.0

ASTM D412

 

Elongation at break

%

>70

ASTM D412

 

Hardness

Shore A

60土5

ISO 48-4

 

Shear strength

MPa

≥2.0

ISO 4587

 

Thermal conductivity

W/m·K

0.6+0.06

ISO 22007-2

 

Volume resistivity

Ω·cm

1×1014

ASTM D257

 

Breakdown voltage

KV/mm

≥15

ASTM D149

 

Operating Temperature

℃

-60~200

-

 

Flame Rating

Grade

V-0

UL94

Key Features and Benefits


Bonding with thermal conductivity: Combines adhesive functionality with a thermal conductivity of 0.6 ± 0.06 W/m·K for joints where heat transfer is part of the design requirement.
Electrical insulation: Provides a specified dielectric strength of ≥15 kV/mm for electrically insulating bond lines.
Firmer cured consistency: A hardness of 60 ± 5 Shore A supports applications requiring a more substantial cured silicone material.
Elastomeric joint formation: Forms a silicone elastomer for bonding and sealing interfaces between assembled parts.

Wide operating temperature range: Offers a specified service range of −60°C to +200°C for applications exposed to temperature variation.


Potential Applications


Electronic Assembly Bonding

Bonding components to supports or housings where the joint must combine electrical insulation with heat transfer.


Component Fixing and Support

Securing parts within electronic or industrial assemblies where cured adhesive hardness is a material selection consideration.


Housing and Interface Sealing

Sealing joints around covers, housings, and component interfaces, subject to adhesion and sealing-performance verification.


Thermally Conductive Bond Lines

Creating bonded interfaces where thermal conductivity, electrical isolation, and mechanical attachment must be considered together.


Selecting LCF1901 for Your Assembly

Evaluate LCF1901 against the actual substrates, joint dimensions, electrical requirements, and operating conditions. Thermal performance depends on bond-line thickness, contact area, and interface quality as well as the adhesive’s thermal conductivity.


Surfaces should be clean, dry, and free from contaminants before application. Refer to the technical data sheet for cure conditions, processing guidance, and substrate preparation requirements.


Frequently Asked Questions


Is LCF1901 a thermal glue?

LCF1901 can be considered for thermal glue applications that require a curing silicone adhesive with electrical insulation. Its thermal conductivity is 0.6 ± 0.06 W/m·K. Confirm that the completed bond line meets the assembly’s heat-transfer requirements.


What does 60 Shore A hardness indicate?

Shore A hardness describes the cured material’s resistance to indentation. LCF1901 has a specified hardness of 60 ± 5 Shore A. Hardness should be assessed alongside adhesion, flexibility, and joint geometry when selecting an adhesive.


Is tensile strength the same as adhesive bond strength?

No. The specified tensile strength of ≥2.0 MPa describes the cured material’s resistance to tensile loading. Adhesive bond strength depends on the substrates, surface preparation, cure conditions, and joint design.


Reliable thermal performance starts with the right materials.

With 15 years of expertise, Union Tenda provides thermal interface materials tailored to your applications—from thermal pads and gels to greases, potting compounds and phase change materials. Our in-house R&D and testing capabilities, backed by a 20,000 m² production base, support customers across electronics, AI, EVs and energy storage.

Let's connect to discuss your thermal management needs.



Test Items

Unit

LCF1901

Test Standard

Before curing

Appearance

-

White/semi-flowable

Visual

 

Density

g/cm3

1.65±0.1

ASTM D792

 

Extrusion rate

g/min

>1200

φ3.18mm/0.62MPa

 

Surface Drying Time(25℃)

min

5-15

ASTM D2377

 

Full cure time

d

3-7

-

 

Curing type

-

Single-component, methanol-releasing type

-

After curing

Tensile strength

MPa

≥2.0

ASTM D412

 

Elongation at break

%

>70

ASTM D412

 

Hardness

Shore A

60土5

ISO 48-4

 

Shear strength

MPa

≥2.0

ISO 4587

 

Thermal conductivity

W/m·K

0.6+0.06

ISO 22007-2

 

Volume resistivity

Ω·cm

1×1014

ASTM D257

 

Breakdown voltage

KV/mm

≥15

ASTM D149

 

Operating Temperature

℃

-60~200

-

 

Flame Rating

Grade

V-0

UL94

Typical Applications


-Adhesion and sealing of electronic components and devices
-Sealing of automotive electronics, sensors, and other equipment
-Sealing and protection of electrical/electronic enclosures
-Fields with high environmental sealing requirements, such as machinery equipment and pipelines

Features and Advantages


-Excellent insulation and thermal conductivity properties
-Good adhesion and sealing, with no detachment after long-term use
-Moisture-proof, shock-resistant, resistant to corona discharge, and anti-leakage
-Excellent weather resistance, UV-resistant, moisture-resistant, and withstands extreme temperatures, suitable for both indoor and outdoor use.


Contact

Tel:+86-13691979380
+86-19065180554

E-mail:elvinlen@szutd.com
Carly@szutd.com

Address:8th Floor, Tower B, Lechuanghui Building, No. 1211 Guanguang Road, Longhua District, Shenzhen City, Guangdong Province