LCF400Y Thermally Conductive Silicone Potting Compound

LCF400Y is a low-viscosity, two-component thermally conductive silicone potting compound designed for electronic components and printed circuit boards (PCBs). With a thermal conductivity of 4 W/m·K, it helps transfer heat from heat-generating components to metal housings or heat spreaders while providing electrical insulation and environmental protection.

Its excellent flowability allows the material to fill gaps around components and accommodate complex assemblies. LCF400Y cures without releasing small-molecule by-products and is non-corrosive to a range of substrates.

The cured silicone helps protect electronic assemblies against moisture, contamination, vibration, and mechanical shock. It is suitable for applications exposed to temperature variations and thermal cycling, supporting reliable operation in demanding environments.

Test Items	Unit	LCF400Y		Test Standard
		Component A	Component B
Appearance	-	White fluid	Pink fluid	Visual
Viscosity	mPa·s	20000±4000	20000±4000	ASTM E3116
Mixing Ratio	-	1:1		-
Performance after mixing
Viscosity	mPa·s	20000±4000		ASTM E3116
Surface Drying Time(25℃)	min	80~120		ASTM C679
Performance after curing
Appearance	/	Pink solid		Visual
Thermal Conductivity	W/m·K			ISO 22007-2
Density	g/cm3	3.1±0.05		ASTM D792
Hardness	Shore A	65±5		ISO 48-4
Tensile Strength	MPa	＞0.85		ASTM D412
Volume Resistivity	Ω·cm	＞1×1013		ASTM D257
Dielectric Strength	KV/mm	＞15		ASTM D149
Dielectric Constant	1MHz	7.6~8.2		ASTM D150
CTE（25~200℃）	μm/（m·℃）	75		ASTM E228
Flame Rating	Grade	V-0		UL94
Operating Temperature	℃	-40~200		-
Specific Heat Capacity	J/（g·K）	0.858		ASTM E1269

Features and Benefits

Thermal conductivity of 4 W/m·K: 

Helps dissipate heat from electronic components to surrounding housings or heat spreaders.

Low viscosity and excellent flowability: 

Facilitates potting around components and within complex assemblies.

Two-component system: 

Supplied in separate components for mixing before application.

Electrical insulation: 

Provides an insulating encapsulation layer around electronic components.

Moisture protection: 

Helps limit exposure to moisture and environmental contaminants.

Vibration damping: 

Cushions components against vibration and mechanical shock.

Non-corrosive curing: 

Cures without releasing small-molecule by-products that could affect sensitive assemblies.

Typical Applications

LCF400Y thermally conductive silicone potting compound is suitable for potting and encapsulation applications that require both heat transfer and electrical insulation, including:

---Power modules and LED driver power supplies
---Inverters and electronic ballasts
---Electronic control units and sensors
---LED lighting components
---Photovoltaic junction boxes

---Industrial electronic assemblies

Thermal Management and Potting Protection

By filling the space between electronic components and the surrounding enclosure, LCF400Y creates a heat-transfer path that helps reduce heat buildup. Its combination of thermal conductivity, electrical insulation, and vibration damping makes it suitable for protecting heat-generating electronic assemblies.

Looking for a Two-Component Thermal Conductive Potting Glue Manufacturer?

Contact our team to discuss LCF400Y for your application and request technical information. Selection should take into account the assembly design, substrate compatibility, processing requirements, and operating conditions.