3 w/m·K Thermally Conductive Silicone Potting Compound | LCF300Y

LCF300Y is a low-viscosity, two-component thermally conductive silicone potting compound with a thermal conductivity of 3 W/m·K. Its excellent flowability makes it suitable for potting electronic components and circuit boards. It cures without releasing small molecules and provides thermal conductivity and electrical insulation without causing corrosion to substrates.

This thermal potting material is primarily used in driver power supplies, sensors, and photovoltaic junction boxes. It protects electrical and electronic components against high humidity, extreme temperatures, thermal cycling stress, mechanical shock, vibration, mold, and contamination.
As a high thermal conductivity potting compound, LCF300Y transfers heat from individual components or the entire PCB to metal enclosures or heat spreaders without requiring direct contact between them. This heat transfer helps improve the operating efficiency and service life of heat-generating electronic components.

Key Features:

--Thermal conductivity: 3 W/m·K
--Low viscosity and excellent flowability for potting electronic components and circuit boards
--Two-component packaging for ease of use
--No small-molecule release during curing
--Electrical insulation and non-corrosive curing
--Waterproof and airtight protection
--Thermal conductivity and vibration damping

Typical Applications:

--Driver power supplies
--Sensors
--Photovoltaic junction boxes
--Electronic components and circuit boards

Looking for a thermal-conductive potting manufacturer for your electronics application? Contact us to discuss your requirements for thermal conductivity, viscosity, curing conditions and potting depth.

We can help you evaluate a suitable thermally conductive silicone potting compound for chargers, power supplies, LED drivers, sensors and other electronic assemblies.