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  • LCF200Y 2W/m·K Two-component Thermally Conductive Silicone Potting Compounds
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  • 03-insulation-protection 拷贝.jpg
  • 应用场景.png
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  • LCF200Y 2W/m·K Two-component Thermally Conductive Silicone Potting Compounds
  • 01-core-benefits 拷贝.jpg
  • 02-heat-transfer-v2 拷贝.jpg
  • 03-insulation-protection 拷贝.jpg
  • 应用场景.png
  • Potting-Compound-In-Use-Pic2_600x600_opt-600x600.jpg
  • 62dff3f17de39.jpg

LCF200Y 2W/m·K Two-component Thermally Conductive Silicone Potting Compounds

Specification:
Thermal conductivity: 2 W/m·K
Two-part package, easy to use
Waterproof and air-tight
Thermally conductive vibration dampening
Introduction:
LCF200Y is a low-viscosity, two-component thermally conductive silicone potting compound with excellent fluidity. It releases no small molecules during curing and provides thermal conductivity and electrical insulation without corroding substrates.

Ideal for driver power supplies, sensors, photovoltaic junction boxes, and PCBs, it protects electronics against moisture, extreme temperatures, thermal cycling, shock, vibration, mold, and contamination. It efficiently transfers heat to metal enclosures or heat spreaders, helping improve component efficiency and service life.
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  • Product introduction
  • Technical Parameters
  • Product Application
  • Product Characteristics
LCF200Y 2 W/m·K Two-Part Thermally Conductive Silicone Potting Compound

LCF200Y is a low-viscosity, two-part thermally conductive silicone potting compound designed for electronic components and circuit boards. With a thermal conductivity of 2 W/m·K and excellent fluidity, it combines efficient heat transfer with electrical insulation and reliable protection.

This two-component silicone potting material releases no small molecules during curing and is non-corrosive to various substrates. It is suitable for potting driver power supplies, sensors, photovoltaic junction boxes, and other electronic assemblies.

Thermal Management and Electronic Protection

LCF200Y provides reliable protection for electrical and electronic devices exposed to high humidity, extreme temperatures, thermal cycling stress, mechanical shocks, vibration, mold, and contamination.

Its contact-free thermal resistance design efficiently transfers heat from discrete components or the entire PCB to metal enclosures or heat spreaders, helping improve the efficiency and service life of heat-generating electronic components.

Test Items

Unit

LCF200Y

Test Standard

 

 

Component A

Component B

 

Appearance

-

White fluid

Gray fluid

Visual

Viscosity

mPa·s

10000±2000

10000±2000

ASTM E3116

Mixing Ratio

-

1:1

-

Performance after mixing

Viscosity

mPa·s

10000±2000

ASTM E3116

Surface Drying Time(25℃)

min

60±20

ASTM C679

Performance after curing

Appearance

/

Gray solid

Visual

Thermal Conductivity

W/m·K

2.0±0.2

ISO 22007-2

Density

g/cm3

2.7±0.05

ASTM D792

Hardness

Shore A

50±5

ISO 48-4

Tensile Strength

MPa

＞0.85

ASTM D412

Volume Resistivity

Ω·cm

＞1×1013

ASTM D257

Dielectric Strength

KV/mm

＞15

ASTM D149

Dielectric Constant

1MHz

6.2~6.8

ASTM D150

CTE（25~200℃）

μm/（m·℃）

124

ASTM E228

Flame Rating

Grade

V-0

UL94

Operating Temperature

℃

-40~200

-

Specific Heat Capacity

J/（g·K）

0.964

ASTM E1269


Features and Advantages

Excellent thermal conductivity: 2 W/m·K for efficient heat transfer.

Low viscosity and good fluidity: Supports potting with rapid bubble elimination.

Flexible curing options: Cures at room temperature, with faster curing available through heating.

Non-corrosive to substrates: Suitable for protecting various electronic components and assemblies.

Electrical insulation: Provides insulating protection after curing.



Typical Applications

LCF200Y thermally conductive silicone potting compound is suitable for:

Power modules, inverters, and ballasts

Driver power supplies and sensors

Photovoltaic junction boxes

Electronic control units

LED lighting components for industrial applications

PCBs and other electronic assemblies requiring thermally conductive potting protection


Discuss Your Thermal Potting Requirements

Looking for a thermal-conductive potting manufacturer? Contact us to discuss LCF200Y thermally conductive silicone potting compound for your electronic protection and thermal management requirements.

Test items
 LCF080Y
 Test Method

A Part
 B Part
Appearance
 White fluid
 Grey fluid
 Visual
Adhesion
 10000±1000
 10000±1000
 ASTM D2857
Mixing ratio
 1:1
 /
Performance after mixing
Adhesion
 10000/25℃
 ASTM E3116
Operable time
 60min/25℃
 ASTM C679
Curing time
 480min/25℃
 /
Properties after curing
Appearance
 Gray solid
 Visual
Thermal Conductivity
 2.0±0.2W/m.k
 ISO22007
Hardness
 50±5 ShoreA
 ASTM D2240
Specific Gravity
 2.70g/cm3 ±0.05
 ASTM D792
Tensile Strength
 0.85MPa
 ASTM D412
Volume Resistivity
 1.6×1013 Ω·cm
 ASTM D257
Breakdown Voltage
 15KV/mm
 ASTM D149
Dielectric Constant
 4.2(@1MHz)
 ASTM D150
Linear expansion coefficient
 180μm/（m·℃）
 ASTM E228
Flame Rating
 V-0
 UL94
 Continuous Use Temp -40~150℃
 /

Potting protection for power modules, inverters and ballasts
Potting protection of electronic control unit and sensors
Potting protection of LED lighting components
Potting applications for other suitable products
High thermal conductivity, low viscosity
Good fluidity and rapid defoaming
Curing at room temperature, heating can speed up the curing speed
No corrosion to the substrate

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