Thermal Potting Compound
  • 1.5 W/m.k Two-Part Thermal Conductive Silicone Potting Compounds
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  • Potting-Compound-In-Use-Pic2_600x600_opt-600x600.jpg
  • 02-heat-transfer-v2 拷贝.jpg
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  • 1.5 W/m.k Two-Part Thermal Conductive Silicone Potting Compounds
  • 60.jpg
  • Potting-Compound-In-Use-Pic2_600x600_opt-600x600.jpg
  • 02-heat-transfer-v2 拷贝.jpg
  • 03-insulation-protection 拷贝.jpg
  • 04-flow-filling-v2 拷贝.jpg
  • 应用场景.png

1.5 W/m.k Two-Part Thermal Conductive Silicone Potting Compounds

Specification:
Thermal conductivity: 1.5 W/m·K
Two-part package, easy to use
Waterproof and air-tight
Thermally conductive vibration dampening
Introduction:
LCF150Y is a two-part silicone thermally conductive potting compound with excellent flowability. It fills gaps between electronic modules to enhance heat dissipation and provide electrical insulation. After room-temperature curing, it offers dustproof, moisture-proof, shockproof, and thermally conductive protection. Widely used in LED modules, power modules, and automotive electronics.
  • Product introduction
  • Technical Parameters
  • Product Application
  • Product Characteristics


LCF150Y Thermally Conductive Silicone Potting Compound

LCF150Y is a low-viscosity, two-component thermally conductive silicone potting compound with a thermal conductivity of 1.5 W/m·K. It offers excellent fluidity for potting electronic components and circuit boards. 

No small molecules are released during curing, and the cured material provides excellent thermal conductivity and electrical insulation without causing corrosion to various substrates.

Test Items

Unit

LCF150Y

Test Standard

 

 

Component A

Component B

 

Appearance

-

White fluid

Gray fluid

Visual

Viscosity

mPa·s

5500±1000

5000±1000

ASTM E3116

Mixing Ratio

-

1:1

-

Performance after mixing

Viscosity

mPa·s

5500±1000

ASTM E3116

Surface Drying Time(25℃)

min

90~120

ASTM C679

Performance after curing

Appearance

/

Gray solid

Visual

Thermal Conductivity

W/m·K

1.5±0.15

ISO 22007-2

Density

g/cm3

2.50±0.05

ASTM D792

Hardness

Shore A

50±5

ISO 48-4

Tensile Strength

MPa

>0.85

ASTM D412

Volume Resistivity

Ω·cm

>1×1013

ASTM D257

Dielectric Strength

KV/mm

>15

ASTM D149

Dielectric Constant

1MHz

5.0~5.6

ASTM D150

CTE(25~200℃)

μm/(m·℃)

148

ASTM E228

Flame Rating

Grade

V-0

UL94

Operating Temperature

℃

-40~200

-

Specific Heat Capacity

J/(g·K)

0.955

ASTM E1269


Thermal Potting Material for Electronic Protection

This thermal potting material is primarily used in driver power supplies, sensors, photovoltaic junction boxes, and other electronic components and circuit boards. It provides reliable protection for electrical and electronic devices under harsh conditions, including high humidity, extreme temperatures, thermal cycling stress, mechanical shocks, vibration, mold, and contamination.


Efficient Heat Transfer and Vibration Dampening

LCF150Y two-component thermal conductive potting glue efficiently transfers heat from discrete components or the entire PCB to metal enclosures or heat spreaders through its contact-free thermal resistance design. This heat transfer helps improve the efficiency and service life of heat-generating electronic components while providing thermally conductive vibration dampening.


Key Features

  • Thermal conductivity of 1.5 W/m·K: Supports efficient heat transfer.

  • Low viscosity and excellent fluidity: Suitable for potting electronic components and circuit boards.

  • Two-part package: Easy to use.

  • Waterproof and air-tight: Provides protection against moisture.

  • Thermally conductive vibration dampening: Helps protect components exposed to vibration.

  • Electrical insulation and non-corrosive curing: Provides insulation without corroding various substrates.




Thermally Conductive Potting Compound Manufacturer


Looking for a thermal-conductive potting manufacturer for your electronics application? Contact us to discuss your requirements for thermal conductivity, viscosity, curing conditions and potting depth.

We can help you evaluate a suitable thermally conductive silicone potting compound for chargers, power supplies, LED drivers, sensors and other electronic assemblies.


Test items
LCF150Y
Test Method

A Part
B Part

Appearance
White fluid
Grey fluid
Visual
Adhesion
7500±500
7000±500
ASTM D2857
Mixing ratio
1:1
/
Performance after mixing
Adhesion
7000/25℃
ASTM E3116
Operable time
60min/25℃
ASTM C679
Curing time
480min/25℃
/
Properties after curing
Appearance
Gray solid
Visual
Thermal Conductivity
1.5±0.15W/m.k
ISO22007
Hardness
50±5 ShoreA
ASTM D2240
Specific Gravity
2.5g/cm3 ±0.05
ASTM D792
Tensile Strength
0.80MPa
ASTM D412
Volume Resistivity
2×1013 Ω·cm
ASTM D257
Breakdown Voltage
15KV/mm
ASTM D149
Dielectric Constant
3.7(@1MHz)
ASTM D150
Linear expansion coefficient
180μm/(m·℃)
ASTM E228
Flame Rating
V-0
UL94
 Continuous Use Temp -40~150℃
/

TYPICAL APPLICATION

-Automotive electronic devices
-Telecommunication hardware
-Computer and peripherals
-5G base station & infrastructure
-Between a component and heat sink
-EV electric vehicle
High thermal conductivity, low viscosity
Good fluidity and rapid defoaming
Curing at room temperature, heating can speed up the curing speed
No corrosion to the substrate

Contact

Tel:+86-13691979380
+86-19065180554

E-mail:elvinlen@szutd.com
Carly@szutd.com

Address:8th Floor, Tower B, Lechuanghui Building, No. 1211 Guanguang Road, Longhua District, Shenzhen City, Guangdong Province