Thermal Potting Compound
  • 0.8 W/m.k 1:1 Thermal Conductive Silicone Potting Compound
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  • Potting-Compound-In-Use-Pic2_600x600_opt-600x600.jpg
  • 01-core-benefits 拷贝.jpg
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  • 0.8 W/m.k 1:1 Thermal Conductive Silicone Potting Compound
  • LCF080Y 参数.png
  • 60.jpg
  • Potting-Compound-In-Use-Pic2_600x600_opt-600x600.jpg
  • 01-core-benefits 拷贝.jpg
  • 02-heat-transfer-v2 拷贝.jpg
  • 03-insulation-protection 拷贝.jpg
  • 04-flow-filling-v2 拷贝.jpg

0.8 W/m.k 1:1 Thermal Conductive Silicone Potting Compound

Specification:
Combines thermal conduction and heat dissipation
Good fluidity with rapid bubble elimination
Electrical insulation
Moisture and dust protection, and shock absorption
Introduction:
LCF080Y 0.8 W/m·K Silicone Potting Compound
Thermal Conductivity: 0.8±0.08 W/m·K
Operating Temperature: -40~200℃
Hardness: 50±5 Shore A
Surface Drying Time(25℃): 60±20 min
  • Product introduction
  • Technical Parameters
  • Product Application
  • Product Characteristics

LCF080Y 0.8 W/m·Khermally Conductive Silicone Potting Compound

Low-Viscosity Thermal Potting Material for Electronic Protection

Our thermally conductive silicone potting compound is a low-viscosity, two-component material designed for heat transfer, electrical insulation and environmental protection in electronic assemblies.


Its good flowability helps the material fill gaps around components and form close contact with complex surfaces. The silicone cures without releasing small-molecule by-products and is non-corrosive to substrates.


After curing, this thermal potting material creates a heat-transfer path from heat-generating components and circuit boards to metal housings or heat spreaders. By filling air gaps, it helps reduce interfacial thermal resistance and supports effective thermal management.


The cured material also helps protect electronic components against moisture, contamination, temperature extremes, thermal cycling, mechanical shock and vibration, supporting reliable operation in demanding environments.

Features and Advantages

  • Thermal conductivity and electrical insulation: Supports heat dissipation while providing insulation for electronic components.

  • Low viscosity and good flowability: Flows around components and into narrow gaps for thorough encapsulation.

  • Rapid bubble release: Helps trapped air escape during potting.

  • Flexible curing options: Cures at room temperature, with faster curing available through heating.

  • Non-corrosive formulation: Suitable for potting electronic assemblies with sensitive substrates.

  • Environmental protection: Helps shield components from moisture, dirt and mechanical stress.


Typical Applications

Charger Potting and Thermal Management

For charger potting thermal management, the compound combines heat transfer, electrical insulation and protective encapsulation. It helps conduct heat from enclosed electronic components to the housing or heat spreader.


Power Supplies, Power Modules and Inverters

Provides thermally conductive potting protection for driving power supplies, power modules, inverters and ballasts, helping manage heat within compact electronic assemblies.


Electronic Control Units and Sensors

Encapsulates circuit boards, electronic control units and sensors to help protect against humidity, contamination, vibration and temperature cycling.


LED Lighting Components

Supports thermal management and potting protection for LED drivers and other electronic components used in industrial lighting.


Photovoltaic Junction Boxes

Provides insulating encapsulation and environmental protection for photovoltaic junction boxes and related electronic assemblies.


Thermally Conductive Potting Compound Manufacturer


Looking for a thermal-conductive potting manufacturer for your electronics application? Contact us to discuss your requirements for thermal conductivity, viscosity, curing conditions and potting depth.

We can help you evaluate a suitable thermally conductive silicone potting compound for chargers, power supplies, LED drivers, sensors and other electronic assemblies.

Potting protection for power modules, inverters and ballasts
Potting protection of electronic control unit and sensors
Potting protection of LED lighting components
Potting applications for other suitable products
High thermal conductivity, low viscosity
Good fluidity and rapid defoaming
Curing at room temperature, heating can speed up the curing speed

No corrosion to the substrate


Contact

Tel:+86-13691979380
+86-19065180554

E-mail:elvinlen@szutd.com
Carly@szutd.com

Address:8th Floor, Tower B, Lechuanghui Building, No. 1211 Guanguang Road, Longhua District, Shenzhen City, Guangdong Province