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  • LT800 Silicon Nitride Thermal Ceramic Sheet
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  • LT800 Silicon Nitride Thermal Ceramic Sheet
  • 36.jpg
  • 37.jpg
  • 38.jpg
  • 39.jpg
  • 40.jpg
  • 42.jpg
  • 43.jpg
  • 44.jpg
  • 45.jpg

LT800 Silicon Nitride Thermal Ceramic Sheet

Specification:
Thickness: 0.254mm 0.32mm 0.5mm 0.635mm 0.8mm 1.0mm 1.5mm 2.0mm 2.5mm 3.0mm
Laser process into any shape you need
Introduction:
LT800 developed based on ceramic material casting technology have high strength, high toughness, and high thermal conductivity. Based on these characteristics, ALN are widely used in the fifield of power semiconductor substrates that require high-reliability materials. Compared with alumina substrate or aluminum nitride substrate, it has about twice the bending strength.Compared with alumina substrate or ZTA substrate, it has more than three times thermal conductivity. High electrical insulation coefficient of thermal expansion simila to silicon
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  • Product introduction
  • Technical Parameters
  • Product Application
  • Product Characteristics
LT800 developed based on ceramic material casting technology have high strength, high toughness, and high thermal conductivity. Based on these characteristics, ALN are widely used in the fifield of power semiconductor substrates that require high-reliability materials. Compared with alumina substrate or aluminum nitride substrate, it has about twice the bending strength. Compared with alumina substrate or ZTA substrate, it has more than three times thermal conductivity. High electrical insulation coefficient of thermal expansion simila to silicon
Test Item Unit LT800 Test Methods
Appearance / Color
 - Fine crystal/Gray
 Visually
Specific Gravity
 g/cm3
 3.260
 GB/T 2413
Thermal Conductivity（25℃)
 W/m·K
 80 ISO 22007-2
Dielectric Constant
 1MHz
 8~10
 GB/T 5594.4
Breakdown Voltage
 KV/mm
 ≥15
 GB/T 5593
Flexural strength
 MPa
 800
 GB/T 5593
Warpage
 ‰
 ≤2
 -
Surface Roughness
 μm
 0.2-0.6
 GB/T 6062
Water Absorption
 %
 0 GB/T 3299
Volume Resistivity（20℃）
 Ω.cm
 7.08*1014
 GB/T 5594.5
Thermal Expansivity
 10-6 ℃-1 （20-300℃）
 2.7
 GB/T 5594.3
10-6 ℃-1 （300-800℃）
 3.2

Size (mm)
Thickness
 0.254
 0.32
 0.5
 0.635
 0.8
 1.0
 1.5
 2.0
 2.5
 3.0
Length*width
 114.3*114.3 / 120*120

High power applications represented by new energy generation and industrial drive need reliable, scalable, high power density and low stray inductance power modules. In order to meet these requirements, hvigbt LV100 package has been recognized and successfully applied in the industrial field.
High thermal conductivity and low thermal resistance
High strength, high toughness
The friction coefficient is small and the high temperature creep is small
Excellent comprehensive performance and high reliability

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Tel:+86-13691979380

E-mail:ElvinLen@szutd.com

Address:Union Tenda Technology Park, No. 61, Zhangqi Road, Guixiang Community,Guanlan Street, Longhua District, Shenzhen