LEN500 Non-Silicone Phase Change Thermal Grease

5.0 W/m·K Thermal Conductivity for Demanding Thermal Interfaces

LEN500 is a non-silicone phase change thermal grease designed for electronic assemblies that require effective heat transfer across component-to-cooler interfaces. Its thermally conductive filler system delivers a thermal conductivity of 5.0 ± 0.3 W/m·K, with a specified thermal impedance of 0.006 °C·in²/W.

With a phase change temperature of ≥45°C, LEN500 softens as the material reaches its transition temperature, improving conformity to the mating surfaces. This promotes surface wetting and helps fill microscopic irregularities, reducing interfacial air gaps and contact thermal resistance.

The silicone-free formulation avoids silicone oil leakage and migration concerns. With a bond line thickness (BLT) of ≤20 μm and multiple application options, LEN500 supports thin thermal interfaces in both manual assembly and automated production.

Performance Highlights

Versatile application: Compatible with screen printing, manual application, and automatic dispensing, with adjustable viscosity options.

Electrical Properties and Design Considerations

LEN500 uses a thermally conductive filler system that reduces its electrical insulation performance. It is a non-insulating thermal interface material and must not be used as an electrical insulation barrier.

Use LEN500 where electrical isolation is not required from the thermal grease itself. If the assembly requires electrical insulation, provide a separate, appropriately rated insulation solution. Control material placement to prevent contact with exposed conductors or bridging between electrical contacts.

Technical Specifications

Recommended Application Areas

LEN500 phase change thermal interface material (TIM) is designed for the following interfaces where electrical insulation is provided elsewhere or is not required:

LED lighting: Between LED assemblies and cooling structures.

Processing Options

Choose screen printing for patterned coverage, manual application for flexible assembly, or automatic dispensing for controlled material placement. Adjustable viscosity options help match LEN500 silicone-free thermal paste to the selected deposition process and interface geometry.

Contact us for LEN500 technical information, viscosity options, and material selection support for your thermal interface requirements.

Reliable thermal performance starts with the right materials.

With 15 years of expertise, Union Tenda provides thermal interface materials tailored to your applications—from thermal pads and gels to greases, potting compounds and phase change materials. Our in-house R&D and testing capabilities, backed by a 20,000 m² production base, support customers across electronics, AI, EVs and energy storage.

Let's connect to discuss your thermal management needs.