LEN400 Non-Silicone Phase Change Thermal Grease

4.0 W/m·K Thermal Conductivity for Low-Resistance Thermal Interfaces

LEN400 is a non-silicone phase change thermal grease formulated with thermally conductive fillers for heat transfer between electronic components and cooling assemblies. It combines a thermal conductivity of 4.0 ± 0.3 W/m·K with a thermal impedance of 0.008 °C·in²/W, supporting applications where low thermal interface resistance is a key design requirement.

With a phase change temperature of ≥45°C, LEN400 softens as the material reaches its transition temperature. This behavior improves surface conformity and wetting, helping fill microscopic gaps between mating surfaces and reduce contact thermal resistance.

The silicone-free formulation avoids silicone oil leakage and related migration concerns. Supporting a bond line thickness (BLT) of ≤15 μm, LEN400 forms a thin thermal interface and accommodates screen printing, manual application, and automatic dispensing.

Key Features and Benefits

Flexible processing: Supports manual and automated application, with adjustable viscosity options to suit processing requirements.

Electrical Characteristics and Material Selection

The thermally conductive filler system in LEN400 reduces its electrical insulation performance. LEN400 is a non-insulating thermal interface material and must not be relied upon to provide electrical isolation.

Select LEN400 for thermal interfaces where electrical insulation is not required from the grease itself. Where electrical isolation is necessary, the assembly must provide a separate, appropriately rated insulation solution. Material placement should prevent contact with exposed conductors and unintended bridging between electrical contacts.

Technical Specifications

Typical Applications

LEN400 phase change thermal interface material (TIM) is suitable for the following applications where electrical insulation is not required from the thermal grease:

LED lighting: Heat transfer between LED assemblies and heat dissipation structures.

Application and Processing

LEN400 silicone-free thermal paste can be screen printed, manually applied, or automatically dispensed according to the interface geometry and production process. Adjustable viscosity options support different material deposition requirements.

Contact us to discuss LEN400 specifications, viscosity options, and suitability for your thermal and electrical design requirements.