LEN380 Non-Silicone Phase Change Thermal Grease

Efficient Heat Transfer Across Component-to-Heat-Sink Interfaces

LEN380 is a silicone-free phase change thermal grease designed to improve thermal contact between heat-generating electronic components and cooling assemblies. With a thermal conductivity of 3.8 ± 0.3 W/m·K and a thermal impedance of 0.014 °C·in²/W, it supports thermal designs that require effective heat conduction and low interface resistance.

As the material reaches its phase transition temperature of ≥45°C, it softens and conforms more closely to the mating surfaces. This phase change behavior promotes surface wetting and helps fill microscopic irregularities, reducing air gaps that can restrict heat transfer.

The non-silicone formulation avoids silicone oil leakage and associated migration concerns. A bond line thickness (BLT) of ≤15 μm supports thin thermal interfaces, while multiple application methods make LEN380 suitable for both manual assembly and automated production.

Product Advantages

Thermal Conductivity and Interface Performance

LEN380 combines 3.8 ± 0.3 W/m·K thermal conductivity with low thermal impedance to facilitate heat flow from electronic components to heat dissipation hardware.

Phase Change Surface Wetting

The material softens during its phase transition, improving conformity to contact surfaces and helping reduce contact thermal resistance.

Silicone-Free Formulation

By excluding silicone oil, LEN380 addresses silicone oil leakage and migration concerns in electronic assemblies.

Thin Bond Line Capability

A BLT of ≤15 μm allows a thin layer of thermal interface material between closely fitted components and heat sinks.

Processing Flexibility

LEN380 supports screen printing, manual application, and automatic dispensing. Adjustable viscosity options help accommodate different deposition methods and assembly requirements.

Technical Specifications

Application Areas

• Computing and integrated electronics: Thermal interfaces between CPUs, GPUs, ICs, and heat sinks.

• Power electronics: Heat transfer between power modules, power semiconductors, and cooling assemblies.

• Automotive electronics: Thermal management in battery management systems (BMS) and engine control units (ECUs).

• Telecommunications: Component cooling in routers, base station equipment, and related communication systems.

• LED lighting: Thermal coupling between LED assemblies and heat dissipation structures.

Select an Application Method for Your Process

Use screen printing for patterned material coverage, manual application for flexible assembly, or automatic dispensing for controlled placement. LEN380 phase change thermal interface material (TIM) offers viscosity options to support your chosen process.

Contact us for product specifications, viscosity selection, and application guidance for LEN380 non-silicone thermal paste.