LEN300 Non-Silicone Phase Change Thermal Grease

3.0 W/m·K Thermal Conductivity with Low Thermal Impedance

LEN300 is a non-silicone phase change thermal grease developed to transfer heat between electronic components and heat sinks. Featuring a thermal conductivity of 3.0 ± 0.3 W/m·K and a thermal impedance of 0.016 °C·in²/W, it combines effective heat conduction with low resistance across the thermal interface.

With a phase change temperature of ≥45°C, LEN300 softens during the transition to improve contact with mating surfaces. This enhanced conformity helps fill microscopic surface gaps and promotes wetting, reducing contact thermal resistance between the heat source and cooling assembly.

Its silicone-free formulation eliminates silicone oil leakage associated with silicone-based materials. Supporting a bond line thickness (BLT) of ≤15 μm, LEN300 provides a thin thermal interface for closely fitted electronic assemblies.

Key Performance Features

Effective thermal conduction: Thermal conductivity of 3.0 ± 0.3 W/m·K supports heat transfer from components to cooling hardware.

Low thermal impedance: A specified value of 0.016 °C·in²/W supports applications where interface thermal resistance is a key design consideration.

Phase change wetting: Softening at the phase transition improves conformity to surface irregularities and helps minimize interfacial air gaps.

Non-silicone formulation: Avoids silicone oil leakage and related migration concerns.

Thin interface capability: Supports a BLT of ≤15 μm for assemblies requiring a controlled thermal interface.

Flexible application methods: Compatible with screen printing, manual application, and automatic dispensing, with adjustable viscosity options.

Technical Specifications

Typical Applications

Processor and IC Cooling

Thermal interfaces between CPUs, GPUs, integrated circuits, and heat sinks, supporting heat transfer across component-to-cooler contact surfaces.

Power Modules and Semiconductors

Thermal management between power electronic devices and cooling assemblies where low interface resistance is important.

Automotive Control Electronics

Thermal interface applications in battery management systems (BMS) and engine control units (ECUs).

Network and Communication Equipment

Heat transfer interfaces for electronic components in routers, base stations, and related telecommunications hardware.

LED Assemblies

Thermal coupling between heat-generating LED components and heat dissipation structures.

Application Options for Electronic Assembly

LEN300 silicone-free thermal paste accommodates different deposition methods and production needs. Screen printing supports patterned coverage, manual application offers assembly flexibility, and automatic dispensing enables controlled material placement.

Contact us to discuss LEN300 viscosity options, processing requirements, and suitability for your thermal interface design.