Thermal Phase Change Materials
  • 1.2 W/m·K 0.026 ℃·in²/W Non-Silicone PCM Phase Change Thermal Grease
  • LEN120 参数.png
  • Non-Silicone Phase Change Thermal Grease (4).jpg
  • Non-Silicone Phase Change Thermal Grease (5).JPG
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  • 1.2 W/m·K 0.026 ℃·in²/W Non-Silicone PCM Phase Change Thermal Grease
  • LEN120 参数.png
  • Non-Silicone Phase Change Thermal Grease (4).jpg
  • Non-Silicone Phase Change Thermal Grease (5).JPG
  • Non-Silicone Phase Change Thermal Grease-9.jpg
  • Non-Silicone Phase Change Thermal Grease-10.jpg

1.2 W/m·K 0.026 ℃·in²/W Non-Silicone PCM Phase Change Thermal Grease

Specification:
Thermal Conductivity:1.2±0.1 W/m·K
Thermal Impedance:0.026 ℃·in²/W
Operating Temperature:-40~150℃
Phase Change Temperature:≥45℃
BLT:≤10 μm
Density:1.7 g/cm3
Introduction:
LEN120 Non-Silicone Phase Change Thermal Grease
LEN120 is a non-silicone phase change thermal grease designed to improve heat transfer between electronic components and heat sinks. With a phase change temperature of ≥45°C, the material softens as it reaches its transition temperature, improving surface conformity and wetting to help reduce contact thermal resistance.
  • Product introduction
  • Technical Parameters
  • Product Application
  • Product Characteristics

LEN120 Non-Silicone Phase Change Thermal Grease


Thin Bond Line, Effective Surface Wetting, Reliable Thermal Contact


LEN120 is a non-silicone phase change thermal grease designed to improve heat transfer between electronic components and heat sinks. With a phase change temperature of ≥45°C, the material softens as it reaches its transition temperature, improving surface conformity and wetting to help reduce contact thermal resistance.

Its silicone-free formulation eliminates silicone oil leakage associated with silicone-based thermal compounds. Supporting a bond line thickness (BLT) of ≤10 μm, LEN120 provides a thin thermal interface for applications requiring close contact between mating surfaces.


This phase change thermal interface material (TIM) can be applied by screen printing, manual application, or automatic dispensing. Adjustable viscosity options support different application methods and production requirements.


Test Items

Unit

LEN120

Test Standard

Appearance

-

White

Visual

Density

g/cm3

1.7±0.2

ASTM D792

Bond Line Thickness (BLT)

μm

≤10

-

Dielectric Strength

KV/mm

≥6

ASTM D149

Dielectric Constant

-

4.21

ASTM D150

Thermal Conductivity

W/m·K

1.2±0.1

ISO 22007-2

Thermal Impedance

℃·in²/W

0.026

ASTM D5470(40psi@BLT)

Thermal Impedance

℃·cm²/W

0.167

ASTM D5470(40psi@BLT )

Operating Temperature

℃

-40~150

-

Key Features and Benefits


Non-silicone formulation: Suitable for applications where silicone oil migration or contamination is a concern.


Phase change behavior: Improves conformity to mating surfaces and helps fill microscopic surface irregularities.


Low thermal impedance: Helps reduce resistance to heat flow across the thermal interface.


Thin bond line: Supports a BLT of ≤10 μm for closely fitted thermal assemblies.


Reliable stability: Designed to maintain consistent thermal contact in electronic applications.


Flexible processing: Compatible with screen printing, manual application, and automated dispensing, with adjustable viscosity options.


Typical Applications


Electronic Components and LED Lighting

Thermal interfaces between ICs, CPUs, GPUs, or LED assemblies and heat sinks, helping transfer heat from the component to the cooling assembly.

Power Electronics

Thermal management for power modules and power semiconductors requiring effective heat transfer across closely fitted interfaces.

Automotive Electronics

Thermal interface applications in battery management systems (BMS) and engine control units (ECUs).

Networking and Telecommunications

Thermal management for heat-generating components in routers, base station equipment, and related communication systems.


Application and Processing

LEN120 thermal paste supports both manual assembly and automated production. Choose screen printing for patterned application, manual application for flexible assembly workflows, or automatic dispensing for controlled material placement.


Contact us to discuss viscosity requirements, application methods, and LEN120 suitability for your thermal interface design.

Test Items

Unit

LEN120

Test Standard

Appearance

-

White

Visual

Density

g/cm3

1.7±0.2

ASTM D792

Bond Line Thickness (BLT)

μm

≤10

-

Dielectric Strength

KV/mm

≥6

ASTM D149

Dielectric Constant

-

4.21

ASTM D150

Thermal Conductivity

W/m·K

1.2±0.1

ISO 22007-2

Thermal Impedance

℃·in²/W

0.026

ASTM D5470(40psi@BLT)

Thermal Impedance

℃·cm²/W

0.167

ASTM D5470(40psi@BLT )

Operating Temperature

℃

-40~150

-

Typical Applications


-Thermal management between heat-generating electronic components such as integrated circuits (ICs), central processing units (CPUs), graphics processing units (GPUs), and LED lighting, and heat sinks
-Thermal management in power modules and power semiconductors
-Thermal applications in vehicle battery management systems (BMS) and engine control units (ECU)
-Thermal management in routers and base station equipment

Features and Advantages


-Non-silicone formulation, no silicone oil leakage
-Reliable stability
-Optimal surface wetting
-Adjustable viscosity for greater operational flexibility

Contact

Tel:+86-13691979380
+86-19065180554

E-mail:elvinlen@szutd.com
Carly@szutd.com

Address:8th Floor, Tower B, Lechuanghui Building, No. 1211 Guanguang Road, Longhua District, Shenzhen City, Guangdong Province