LCM300 Phase Change Thermal Pad

3.0 W/m·K Phase Change Thermal Interface Material

LCM300 is a phase change thermal pad designed to improve heat transfer between electronic components and heat sinks. With a thermal conductivity of 3.0 ± 0.3 W/m·K and a phase change temperature of 45°C, it combines convenient installation with low thermal resistance for demanding electronic cooling applications.

Solid at room temperature, this PCM thermal pad is easy to position during assembly. As it reaches its phase change temperature, the material softens and flows to wet the mating surfaces, filling microscopic surface irregularities and displacing trapped air. This helps reduce contact thermal resistance and improve heat transfer across the interface.

LCM300 is designed for long-service-life applications requiring stable thermal performance. It offers excellent surface wettability and filling performance without silicone oil bleeding.

Key Features and Benefits

• Low thermal impedance: A thermal impedance of 0.022°C·in²/W at 70°C and 40 psi supports efficient heat transfer between components and heat sinks.

• 45°C phase transition: The material conforms to the contact surfaces as it reaches its transition temperature.

• Excellent surface wettability: Helps fill microscopic surface irregularities and reduce insulating air pockets.

• Convenient installation: Solid at room temperature for easier handling and positioning.

• Reliable thermal performance: Designed for applications requiring consistent performance over a long service life.

• No silicone oil bleeding: Helps avoid contamination associated with silicone oil migration.

• Multiple thickness options: Available in 0.13, 0.20 and 0.25 mm thicknesses.

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  How the LCM300 Phase Change TIM Works

  Microscopic irregularities between a component and a heat sink can trap air and restrict heat transfer. LCM300 addresses this by changing from a solid installation form to a more conformable material at its 45°C phase transition temperature.
  
  

  As the material softens and flows, it improves contact with both mating surfaces and fills microscopic voids. This wetting action reduces interfacial thermal resistance, helping heat move from the component into the heat sink.
  
  

  This thermal phase change material is intended for mating thermal interfaces where surface contact and low thermal impedance are critical.

  Typical Applications
  
  

  IC, CPU and GPU Cooling

  Provides a thermal interface between heat-generating integrated circuits, central processing units or graphics processing units and their heat sinks.
  
  

  Power Modules and Power Semiconductors

  Supports heat transfer in power electronics requiring reliable thermal management.
  
  

  Automotive Electronics

  Suitable for thermal interfaces in battery management systems (BMS), engine control units (ECU) and related electronic assemblies.
  
  

  Networking and Telecommunications Equipment

  Supports thermal management in routers, base station equipment and other heat-generating communication devices.
  
  

  LED Lighting
  

  Transfers heat between LED components and heat sinks to support thermal management.
  
  

  Frequently Asked Questions
  
  

  What is a phase change thermal pad?

  A phase change thermal pad is a thermal interface material that is solid at room temperature and softens or flows when it reaches a specified transition temperature. This allows it to conform to mating surfaces, fill microscopic irregularities and reduce contact thermal resistance.
  
  

  What is the phase change temperature of LCM300?

  LCM300 has a phase change temperature of 45°C. At this temperature, the material begins to soften and flow, improving surface contact at the thermal interface.
  
  

  What is the thermal conductivity of LCM300?

  LCM300 has a thermal conductivity of 3.0 ± 0.3 W/m·K. Its specified thermal impedance is 0.022°C·in²/W, measured at 70°C and 40 psi.
  
  

  What thicknesses are available?

  The LCM300 phase change material thermal pad is available in 0.13 mm, 0.20 mm and 0.25 mm thicknesses. Select the thickness according to the assembly’s interface geometry and contact requirements.
  
  

  Where can LCM300 be used?

  LCM300 can be used between heat-generating electronic components and heat sinks in computing, power electronics, automotive electronics, telecommunications equipment and LED lighting.
  
  

  Request LCM300 Product Information

  Contact us for the LCM300 technical datasheet, sample availability and guidance on selecting a thickness for your thermal interface application.