Thermal conductive silica gel mud has good thermal conductivity and insulation, no flflow, no solidification, no volatilization, high and low temperature resistance, no sticking to hands, strong plasticity, can be molded into any shape according to the demand, can be used repeatedly, easy to operate and other characteristics, and is filled between the uneven electronic components to be cooled and the radiator / shell, so as to make it close contact and reduce the thermal resistance, It can reduce the temperature of electronic components quickly and effectively, so as to prolong the service life of electronic components