At present, the development of science and technology is rapid, the high-tech advanced electronic products on the market are changing with each passing day, and it is very popular among friends of consumers, and any accessories used in the installation process of electronic products are particularly important, including the selection of some conductive materials and other accessories. Any electronic product will generate a lot of heat during the operation process. In order to have a long service life and good customer experience, it is inevitable to design the internal heat dissipation process of the product. At present, the widely used thermal silica film is commonly used by many electronic manufacturers. Thermally conductive material.
The thermal conductive silicone pad is specially used to fill the gap between the heat source and the heat dissipating component by using the filling of the gap and the heat conducting powder to transfer the heat, thereby achieving the effect of dissipating heat. The application of the heat conducting silicone sheet not only has the effect of dissipating heat, but also can be used in the component. The effect of insulation and shock absorption reinforcement is the best choice for the design and development of ultra-thin electronic products. Many people will doubt that the thermal conductivity of metal products is much higher than that of thermal silica gel sheets. Why not use thermal conductive silicone sheets if they are not directly conductive with metal. for example:
1. CPU and heat sink are the most common heat sink combination in daily life. If metal is used, unless there is only one possibility, the heat sink and the CPU are integrated, otherwise there will be a gap. Any heat conduction scheme is basically very short. Difficult to achieve the effect of heat conduction, and the thermal conductivity of the thermal conductive silicone sheet material is adjustable, and the compression performance is very good, can fill any gap to achieve the best thermal conductivity, and the thermal conductive silicone sheet has a natural micro-viscosity, and the operation is also Very convenient. Secondly, the thermal conductive silica gel sheet can effectively reduce the contact thermal resistance generated between the heat source interface and the contact surface of the heat sink member, and enhance the performance of the electronic device. Therefore, in the development process of the electronic product cooling solution, the thermal conductive silica gel sheet is used as the heat conducting medium, which can make the contact surface of the heat source and the heat dissipating terminal or the outer casing more fully, so that the performance is optimized.