Thermal Pad
  • LC300BN Low Specific Gravity Thermal Pad
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  • LC300BN Low Specific Gravity Thermal Pad
  • 2.jpg
  • 3.jpg
  • 4.jpg
  • 5.jpg
  • 6.jpg
  • 7.jpg
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LC300BN Low Specific Gravity Thermal Pad

Specification:
Can be cut into specific shape and size according to the use requirements. Glass fiber base material / silicon back adhesive / back adhesive can be selected.
Introduction:
Low specific gravity and low dielectric conductivity hot silicon film is a low density and high thermal conductivity interface material made of boron nitride thermal conductive powder. The weight is only half of that of traditional thermal conductive silica gel, which is suitable for light weight applications. Low dielectric constant and dielectric loss can effectively reduce the delay time in signal transmission, so that the signal reception and transmission can be carried out more smoothly. It is widely used in network communication equipment. The natural micro viscosity and softness of the surface can completely fill the air gap, complete the heat transfer between the heat source and the heat sink, and comprehensively improve the heat dissipation performance.
  • Product introduction
  • Technical Parameters
  • Product Application
  • Product Characteristics
Low specific gravity and low dielectric conductivity hot silicon film is a low density and high thermal conductivity interface material made of boron nitride thermal conductive powder. The weight is only half of that of traditional thermal conductive silica gel, which is suitable for light weight applications. Low dielectric constant and dielectric loss can effectively reduce the delay time in signal transmission, so that the signal reception and transmission can be carried out more smoothly. It is widely used in network communication equipment. The natural micro viscosity and softness of the surface can completely fill the air gap, complete the heat transfer between the heat source and the heat sink, and comprehensively improve the heat dissipation performance.
Test item
Unit
LC300BN
Test Methods
Color
- Off-white
Visually
Thickness
mm
0.5~5
ASTM D374/374M
Hardness
Shore AO
40±5
GB/T531
Hardness
Shore OO
65±10
ASTM D2240
Specific gravity
g/cm3
1.39
ASTM D792
Temp resistance range

-40~120
-
Flame
- V-0
UL 94
Weight loss
% ≤0.5
@150℃240H
Tensile Strength
MPa
0.24
ASTM D412
Elongation at break
% 40 ASTM D412
Tearing strength
KN/mm
0.5
ASTM D624
Breakdown Voltage
KV/mm
≥10
ASTM D149
Volume resistivity
Ω·cm
 1x1013
ASTM D257
Permittivity
@1MHz
3.24
ASTM D150
Dielectric Dissipation
@1MHz
≤0.001
ASTM D150
Thermal conductivity
W/m·k
3.0 ISO 22007-2
Thermal conductivity
W/m·k
3.0 ASTM D5470
Thermal impedance
 ℃·in²/W
0.591
ASTM D5470
Thermal impedance
 ℃·cm²/W
3.812
ASTM D5470
Specific Heat Capacity
 J/g/k
1.331
ASTM E1269

UAV intelligent equipment
5G mobile communication electronic equipment
Network communication electronics
Automotive electronics
Smart wearable devices
High thermal conductivity, low thermal resistance and low specific gravity
Low dielectric constant, low dielectric loss
Low pressure applications to protect sensitive electronic components
Natural stickiness, easy to assemble and rework

Contact

Tel:+86-13691979380

E-mail:ElvinLen@szutd.com

Address:Union Tenda Technology Park, No. 61, Zhangqi Road, Guixiang Community,Guanlan Street, Longhua District, Shenzhen