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  • LC100R High Toughness Thermal Pad
  • LC100R High Toughness Thermal Pad

LC100R High Toughness Thermal Pad

Specification:
Can be cut into specific shape and size according to the use requirements. Glass fiber base material / silicon back adhesive / back adhesive can be selected.
Introduction:
High toughness thermal silica gel pad is a high tensile strength heat conduction material, which has high strength and can be attached to the surface of equipment which has been disassembled for many times, and has good tensile strength, wear resistance and thermal conductivity. It can provide different thickness of coil, easy to die-cut into the required size. It can be used between the interface which is often disassembled, and serves as the heat conduction interface material.
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  • Product introduction
  • Technical Parameters
  • Product Application
  • Product Characteristics
High toughness thermal silica gel pad is a high tensile strength heat conduction material, which has high strength and can be attached to the surface of equipment which has been disassembled for many times, and has good tensile strength, wear resistance and thermal conductivity. It can provide different thickness of coil, easy to die-cut into the required size. It can be used between the interface which is often disassembled, and serves as the heat conduction interface material.
Test item
 Unit
 LC100R
 LC120R
 LC200R
 Test Methods
Color
 - Off-white
 Off-white
 Off-white
 Visually
Thickness
 mm
 0.3~5
 0.3~15
 0.3~10
 ASTM D374/374M
Hardness
 Shore AO
 70±5
 50±5
 50±5
 GB/T531
Specific gravity
 g/cm3
 2.15
 2.41 2.75 ASTM D792
Tensile Strength
 MPa
 2.0 0.60 1.2 ASTM D412
Elongation at break
 % 100 115 80 ASTM D412
Tearing strength
 KN/m
 8.0 2.87 3.5 ASTM D624
Breakdown Voltage
 KV/mm
 ≥10
 ≥10
 ≥10
 ASTM D149
Volume resistivity
 Ω·cm
 1x1013
  1x1013
  1x1013
 ASTM D257
Temperature resistance range
 ℃
 -40~150
 -40~150
 -40~150
 -
Flame
 - V-0
 V-0
 V-0
 UL 94
Weight loss
 %
 ≤0.3
 ≤0.3
 ≤0.3
 @150℃240H
Permittivity
 @1MHz
 4.27
 6.05
 5.98
 ASTM D150
Thermal conductivity
 W/m·k
 1.0 1.2 2.0 ISO 22007-2
Thermal conductivity
 W/m·k
 1.0 1.2 2.0 ASTM D5470
Thermal impedance
  ℃·in2/W
 2.432
 1.730
 1.066
 ASTM D5470
Thermal impedance
  ℃·cm2/W
 15.63
 11.161
 6.877
 ASTM D5470
Specific Heat Capacity
  J/g/k
 1.134
 0.983
 0.974
 ASTM E1269

Mobile terminal removable peripheral surface
Bottom of desktop terminal products
Top of equipment installed on suction top
Fixed Kit / wireless charger
Mobile phone bracket and mobile phone contact surface
Wear resistant, no damage after repeated use
Excellent thermal conductivity and insulation performance
Good flexibility, good gap filling ability
It can be grinded on one side to prevent slipping and dusting
High tensile strength, foldable and good assembly

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E-mail:ElvinLen@szutd.com

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